Xilinx Inc. XCZU4CG-L2SFVC784E

Name: XCZU4CG-L2SFVC784E
Brand: Xilinx Inc.
SKU: 3669370-XCZU4CG-L2SFVC784E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU4CG-L2SFVC784E

Manufacturer:: Xilinx Inc.

Ventron No:: 3669370-XCZU4CG-L2SFVC784E

Description:: IC FPGA 252 I/O 784FCBGA

ECAD Model:

Datasheet:: XCZU4CG-L2SFVC784E

Specifications

Xilinx Inc. XCZU4CG-L2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4CG-L2SFVC784E.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
784
Additional Feature
IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage
0.72V
JESD-30 Code
S-PBGA-B784
Number of I/O
252
Speed
500MHz, 1.2GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 192K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The product is packaged in a 784-BFBGA or FCBGA case and is delivered in a tray packaging. It is an active part with a HTS code of 8542.31.00.01 and a JESD-30 code of S-PBGA-B784. The product has a RAM size of 256KB and falls under the category of uPs/uCs/Peripheral ICs, specifically a MICROPROCESSOR CIRCUIT. It offers various connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The primary attributes of this product include being a Zynq®UltraScale ™ FPGA with 192K Logic Cells. Additionally, it is ROHS3 compliant, ensuring its adherence to environmental regulations.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

There are a lot of Xilinx Inc.
XCZU4CG-L2SFVC784E System On Chip (SoC) applications.

Video Imaging
Embedded systems
Cyber security for critical applications in the aerospace
Optical drive
Sports
Central alarm system
Robotics
Medical
PC peripherals
Medical Pressure

XCZU4CG-L2SFVC784E More Descriptions

FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 192K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU4CG-L2SFVC784E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

View Compare
XCZU4CG-L2SFVC784E

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

YES

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

784

IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)

8542.31.00.01

CMOS

BOTTOM

BALL

0.72V

S-PBGA-B784

252

500MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 192K Logic Cells

ROHS3 Compliant

-

-

-

-

-
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

204

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

NOT SPECIFIED

NOT SPECIFIED

0.742V

0.698V

XCZU4CG-L2SFVC784E vs XCZU5EV-L1FBVB900I
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

YES

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

180

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

NOT SPECIFIED

NOT SPECIFIED

0.742V

0.698V

XCZU4CG-L2SFVC784E vs XCZU2EG-L1SFVA625I
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

-

-

464

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

NOT SPECIFIED

NOT SPECIFIED

-

-

XCZU4CG-L2SFVC784E vs XCZU7EV-2FFVF1517I