Xilinx Inc. XCZU4CG-2FBVB900I

Name: XCZU4CG-2FBVB900I
Brand: Xilinx Inc.
SKU: 3669356-XCZU4CG-2FBVB900I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU4CG-2FBVB900I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669356-XCZU4CG-2FBVB900I

Description:: IC FPGA 204 I/O 900FCBGA

ECAD Model:

Datasheet:: XCZU4CG-2FBVB900I

Specifications

Xilinx Inc. XCZU4CG-2FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU4CG-2FBVB900I.

Factory Lead Time
11 Weeks
Package / Case
900-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B900
Supply Voltage-Max (Vsup)
0.876V
Supply Voltage-Min (Vsup)
0.825V
Number of I/O
204
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 192K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
In 2016, a new packaging technology was introduced for CMOS microprocessor circuits, using a tray form with BALL terminals and a JESD-30 code of R-PBGA-B900. This packaging solution was designed to meet the increasing demand for smaller and more efficient uPs/uCs/peripheral ICs. The HTS code assigned to this packaging is 8542.31.00.01, indicating its classification as a microprocessor circuit. One of the key features of this packaging is its ability to withstand high levels of moisture sensitivity, with a MSL rating of 4 (72 hours). Additionally, the supply voltage for this packaging is set at a minimum of 0.825V, ensuring optimal performance for peripherals such as DMA and WDT.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU4CG-2FBVB900I System On Chip (SoC) applications.

DC-input BLDC motor drive
Microcontroller based SoC ( RISC-V, ARM)
ARM
Robotics
Industrial robot
Communication interfaces ( I2C, SPI )
Central alarm system
Industrial automation devices
Personal Computers
Apple smart watch

XCZU4CG-2FBVB900I More Descriptions

FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
BALL BOTTOM MCU FPGA Active System On Chip (SOC) IC -40C~100C TJ 256KB 533MHz 1.3GHz 0.85V
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 192K, B900, RoHSXilinx SCT
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU4CG-2FBVB900I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Additional Feature

View Compare
XCZU4CG-2FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

900

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.85V

NOT SPECIFIED

R-PBGA-B900

0.876V

0.825V

204

533MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 192K Logic Cells

ROHS3 Compliant

-

-
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

YES

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

625

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B625

0.742V

0.698V

180

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

XCZU4CG-2FBVB900I vs XCZU2EG-L1SFVA625I
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

XCZU4CG-2FBVB900I vs XCZU7EV-1FBVB900E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

XCZU4CG-2FBVB900I vs XCZU9EG-1FFVC900I