Xilinx Inc. XCZU3CG-2SFVC784E
- Part Number:
- XCZU3CG-2SFVC784E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669355-XCZU3CG-2SFVC784E
- Description:
- XCZU3CG-2SFVC784E
- Datasheet:
- XCZU3CG-2SFVC784E
Xilinx Inc. XCZU3CG-2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-2SFVC784E.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingBulk
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O252
- Speed533MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 154K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq? UltraScale ? MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale ? FPGA, 154K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Bulk package.As a whole, this SoC part includes 252 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-2SFVC784E System On Chip (SoC) applications.
Special Issue Editors
Cyberphysical system-on-chip
Special Issue Information
CNC control
Industrial robot
Servo drive control module
Microcontroller
Video Imaging
Functional safety for critical applications in the aerospace
Embedded systems
A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq? UltraScale ? MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale ? FPGA, 154K Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Bulk package.As a whole, this SoC part includes 252 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-2SFVC784E System On Chip (SoC) applications.
Special Issue Editors
Cyberphysical system-on-chip
Special Issue Information
CNC control
Industrial robot
Servo drive control module
Microcontroller
Video Imaging
Functional safety for critical applications in the aerospace
Embedded systems
XCZU3CG-2SFVC784E More Descriptions
FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Cap Ceramic 100uF 10V X5R 20% SMD 1210 85C Embossed T/R
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 154K, C784, RoHSXilinx SCT
IC SOC CORTEX-A9 800MHZ 484FCBGA
FPGA - Field Programmable Gate Array
Cap Ceramic 100uF 10V X5R 20% SMD 1210 85C Embossed T/R
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 154K, C784, RoHSXilinx SCT
IC SOC CORTEX-A9 800MHZ 484FCBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU3CG-2SFVC784E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPbfree CodePart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU3CG-2SFVC784E11 Weeks784-BFBGA, FCBGA0°C~100°C TJBulk2016Zynq® UltraScale ™ MPSoC CGyesActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED252533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 154K Logic CellsROHS3 Compliant------------
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11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGyesActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-----------
-
11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 CompliantYES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
-
11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EG-Active4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 CompliantYES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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