Xilinx Inc. XCZU3CG-2SBVA484I

Name: XCZU3CG-2SBVA484I
Brand: Xilinx Inc.
SKU: 3669327-XCZU3CG-2SBVA484I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU3CG-2SBVA484I

Manufacturer:: Xilinx Inc.

Ventron No:: 3669327-XCZU3CG-2SBVA484I

Description:: IC FPGA 82 I/O 484FCBGA

ECAD Model:

Datasheet:: XCZU3CG-2SBVA484I

Specifications

Xilinx Inc. XCZU3CG-2SBVA484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-2SBVA484I.

Factory Lead Time
11 Weeks
Package / Case
484-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
484
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B484
Supply Voltage-Max (Vsup)
0.876V
Number of I/O
82
Speed
533MHz, 1.3GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 154K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The surface mount option for this particular device is available. The packaging method used is a tray. The device was published in the year 2016. It has a total of 484 terminations, with the terminal form being a ball. The peak reflow temperature for this device is not specified. The maximum supply voltage it can handle is 0.876V. It has a total of 82 input/output connections. The device falls under the category of microprocessor circuit, specifically a microcontroller unit (MCU) or field-programmable gate array (FPGA) architecture.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.
XCZU3CG-2SBVA484I System On Chip (SoC) applications.

Self-aware system-on-chip (SoC)
Published Paper
Central inverter
Measurement testers
Keyboard
Embedded systems
Test and Measurement
Samsung galaxy gear
AC drive control module
Personal Computers

XCZU3CG-2SBVA484I More Descriptions

FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 484-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 154K, A484, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU3CG-2SBVA484I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

View Compare
XCZU3CG-2SBVA484I

Xilinx Inc.

11 Weeks

484-BFBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

484

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.85V

NOT SPECIFIED

R-PBGA-B484

0.876V

82

533MHz, 1.3GHz

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 154K Logic Cells

ROHS3 Compliant

-

-
XCZU7CG-2FFVC1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

360

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

yes

XCZU3CG-2SBVA484I vs XCZU7CG-2FFVC1156E
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

328

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

XCZU3CG-2SBVA484I vs XCZU9CG-2FFVB1156E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

XCZU3CG-2SBVA484I vs XCZU9EG-1FFVC900I