Xilinx Inc. XCZU3CG-1SFVC784E

Name: XCZU3CG-1SFVC784E
Brand: Xilinx Inc.
SKU: 3669274-XCZU3CG-1SFVC784E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU3CG-1SFVC784E

Manufacturer:: Xilinx Inc.

Ventron No:: 3669274-XCZU3CG-1SFVC784E

Description:: XCZU3CG-1SFVC784E

ECAD Model:

Datasheet:: XCZU3CG-1SFVC784E

Specifications

Xilinx Inc. XCZU3CG-1SFVC784E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-1SFVC784E.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Bulk
Published
2016
Series
Zynq® UltraScale ™ MPSoC CG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
252
Speed
500MHz, 1.2GHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 154K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Xilinx Inc. is the brand of this part. It is an Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. The operating temperature range is 0°C~100°C TJ. The packaging is Bulk, and the part status is Active. The HTS Code is 8542.31.00.01. It has 252 I/Os. The RAM size is 256KB. The core processor is a Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™. The peripherals include DMA and WDT. The architecture is MCU and FPGA. The primary attributes of this chip are Zynq® UltraScale ™ FPGA and 154K Logic Cells.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU3CG-1SFVC784E System On Chip (SoC) applications.

ARM
Central alarm system
Level
AC-input BLDC motor drive
Apple smart watch
Mouse
Communication network-on-Chip (cNoC)
Communication interfaces ( I2C, SPI )
Smart appliances
External USB hard disk/SSD

XCZU3CG-1SFVC784E More Descriptions

FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 154K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-784
IC BUF NON-INVERT 3.6V 48TSSOP
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-784; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:784Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU3CG-1SFVC784E

Product Comparison

The three parts on the right have similar specifications to XCZU3CG-1SFVC784E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU3CG-1SFVC784E

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

0°C~100°C TJ

Bulk

2016

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

252

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 154K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

-

-

-

-

-

-

-

-

-

-

-

XCZU3CG-1SFVC784E vs XCZU9CG-2FFVB1156E
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU3CG-1SFVC784E vs XCZU2EG-L1SFVA625I
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

XCZU3CG-1SFVC784E vs XCZU19EG-1FFVD1760E