XCZU3CG-1SFVA625E

Xilinx Inc. XCZU3CG-1SFVA625E

Part Number:
XCZU3CG-1SFVA625E
Manufacturer:
Xilinx Inc.
Ventron No:
3669371-XCZU3CG-1SFVA625E
Description:
XCZU3CG-1SFVA625E
ECAD Model:
Datasheet:
XCZU3CG-1SFVA625E

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Specifications
Xilinx Inc. XCZU3CG-1SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-1SFVA625E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    625-BFBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Bulk
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    180
  • Speed
    500MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 154K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Zynq® UltraScale ™ MPSoC CG series, featuring a package/case of 625-BFBGA FCBGA, is a highly advanced and active product in the market. Its bulk packaging ensures efficient handling and transportation. With a publication date of 2016, this product is up-to-date with the latest technology. It has a moisture sensitivity level of 4 (72 hours) and falls under HTS code 8542.31.00.01. Although the reflow temperature-max (s) is not specified, this product guarantees optimal performance. With 180 I/Os, it offers extensive connectivity options. The architecture of this product is a combination of MCU and FPGA, making it versatile and suitable for a wide range of applications.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU3CG-1SFVA625E System On Chip (SoC) applications.

Test and Measurement
Communication interfaces ( I2C, SPI )
Industrial sectors
Microprocessors
Video Imaging
Flow Sensors
Central alarm system
Functional safety for critical applications in the industrial sectors
Sports
Personal Computers
XCZU3CG-1SFVA625E More Descriptions
FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 154K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-625
IC SOC CORTEX-A9 800MHZ 896FBGA
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-625; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:625Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU3CG-1SFVA625E
Product Comparison
The three parts on the right have similar specifications to XCZU3CG-1SFVA625E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU3CG-1SFVA625E
    XCZU3CG-1SFVA625E
    11 Weeks
    625-BFBGA, FCBGA
    0°C~100°C TJ
    Bulk
    2016
    Zynq® UltraScale ™ MPSoC CG
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 1.2GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 154K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    YES
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B900
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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