Xilinx Inc. XCZU3CG-1SBVA484I
- Part Number:
- XCZU3CG-1SBVA484I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4544179-XCZU3CG-1SBVA484I
- Description:
- IC FPGA 82 I/O 484FCBGA
- Datasheet:
- XCZU3CG-1SBVA484I
Xilinx Inc. XCZU3CG-1SBVA484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU3CG-1SBVA484I.
- Factory Lead Time11 Weeks
- Package / Case484-BFBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O82
- Speed500MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 154K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Xilinx Inc. brand is well-known for its high-quality Embedded - System On Chip (SoC) chips. This particular chip falls under the Embedded - System On Chip (SoC) category and comes in a 484-BFBGA, FCBGA package/case. It has an operating temperature range of -40°C to 100°C TJ, making it suitable for a wide range of applications. The chip was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC CG series. It is currently active and available in the market. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), the chip demonstrates its reliability and durability. The peak reflow temperature for this chip is not specified. It has a speed range of 500MHz to 1.2GHz, allowing for efficient and fast processing. The core processor of this chip consists of Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™, providing powerful and versatile processing capabilities. Additionally, the chip is ROHS3 compliant, ensuring that it meets the necessary environmental standards.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-1SBVA484I System On Chip (SoC) applications.
Automated sorting equipment
Functional safety for critical applications in the aerospace
Level
Embedded systems
Body control module
Medical Pressure
AC drive control module
Special Issue Information
Test and Measurement
Special Issue Editors
The Xilinx Inc. brand is well-known for its high-quality Embedded - System On Chip (SoC) chips. This particular chip falls under the Embedded - System On Chip (SoC) category and comes in a 484-BFBGA, FCBGA package/case. It has an operating temperature range of -40°C to 100°C TJ, making it suitable for a wide range of applications. The chip was published in 2016 and is part of the Zynq® UltraScale ™ MPSoC CG series. It is currently active and available in the market. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), the chip demonstrates its reliability and durability. The peak reflow temperature for this chip is not specified. It has a speed range of 500MHz to 1.2GHz, allowing for efficient and fast processing. The core processor of this chip consists of Dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™, providing powerful and versatile processing capabilities. Additionally, the chip is ROHS3 compliant, ensuring that it meets the necessary environmental standards.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-1SBVA484I System On Chip (SoC) applications.
Automated sorting equipment
Functional safety for critical applications in the aerospace
Level
Embedded systems
Body control module
Medical Pressure
AC drive control module
Special Issue Information
Test and Measurement
Special Issue Editors
XCZU3CG-1SBVA484I More Descriptions
FPGA Zynq UltraScale Family 154350 Cells 20nm Technology 0.85V 484-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 154K, A484, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-484
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-484; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU3CG-1SBVA484I
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 154K, A484, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA484
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-484
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-484; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:484Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU3CG-1SBVA484I
The three parts on the right have similar specifications to XCZU3CG-1SBVA484I.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
-
XCZU3CG-1SBVA484I11 Weeks484-BFBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED82500MHz, 1.2GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 154K Logic CellsROHS3 Compliant-------------
-
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes-----------
-
11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
-
11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant------------
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
25 October 2023
What Is MB10S Bridge Rectifier?
Ⅰ. What is a bridge rectifier?Ⅱ. Overview of MB10S bridge rectifierⅢ. Symbol, footprint and pin configuration of MB10S bridge rectifierⅣ. Technical parameters of MB10S bridge rectifierⅤ. Features of... -
26 October 2023
L293DNE Quadruple Half-H Driver: Symbol, Features, Advantages and More
Ⅰ. Overview of L293DNE quadruple half-H driverⅡ. L293DNE symbol, footprint and pin configurationⅢ. Technical parameters of L293DNE/aⅣ. What are the features of L293DNE?Ⅴ. Working principle of L293DNEⅥ. What... -
26 October 2023
TL494CN PWM Controller: Pin Configuration, Layout Guidelines and Working Principle
Ⅰ. Overview of TL494CN PWM controllerⅡ. Symbol, footprint and pin configuration of TL494CN PWM controllerⅢ. Technical parameters of TL494CN PWM controllerⅣ. What are the features of TL494CN PWM... -
27 October 2023
CD4511BE Decoder: Pin Configuration, Features, Circuit and Applications
Ⅰ. What is a decoder?Ⅱ. Overview of CD4511BE decoderⅢ. Symbol, footprint and pin configuration of CD4511BE decoderⅣ. Technical parameters of CD4511BE decoderⅤ. What are the features of CD4511BE...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.