Xilinx Inc. XCZU2EG-L1SFVC784I

Name: XCZU2EG-L1SFVC784I
Brand: Xilinx Inc.
SKU: 3828157-XCZU2EG-L1SFVC784I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU2EG-L1SFVC784I

Manufacturer:: Xilinx Inc.

Ventron No:: 3828157-XCZU2EG-L1SFVC784I

Description:: IC FPGA 252 I/O 784FCBGA

ECAD Model:

Datasheet:: XCZU2EG-L1SFVC784I

Specifications

Xilinx Inc. XCZU2EG-L1SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2EG-L1SFVC784I.

Factory Lead Time
11 Weeks
Package / Case
784-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
784
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.72V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B784
Supply Voltage-Max (Vsup)
0.742V
Supply Voltage-Min (Vsup)
0.698V
Number of I/O
252
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 103K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The product is packaged in a tray, ensuring safe and secure transportation. With a Moisture Sensitivity Level (MSL) of 4 (72 Hours), the product can withstand moderate levels of moisture exposure for up to 72 hours. It features 784 terminations, providing ample connectivity options. The product falls under the HTS Code 8542.31.00.01, indicating its classification for integrated circuits. The Peak Reflow Temperature (Cel) is not specified, allowing for flexibility in temperature requirements during assembly. The JESD-30 Code R-PBGA-B784 denotes the product's packaging and pin configuration. With a Supply Voltage-Max (Vsup) of 0.742V, the product operates within a specified voltage range. It is equipped with a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 processors, ensuring efficient performance. The product offers various connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. It is also ROHS3 compliant, meeting the necessary environmental standards.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU2EG-L1SFVC784I System On Chip (SoC) applications.

Measurement testers
ARM
Networked sensors
Industrial
Deep learning hardware
DC-input BLDC motor drive
AC-input BLDC motor drive
Mobile market
PC peripherals
Transmitters

XCZU2EG-L1SFVC784I More Descriptions

Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 103K, C784, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA784
IC SOC CORTEX-A53 784FCBGA
IC FPGA 252 I/O 784FCBGA

Product Comparison

The three parts on the right have similar specifications to XCZU2EG-L1SFVC784I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Series

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Published

Pbfree Code

View Compare
XCZU2EG-L1SFVC784I

Xilinx Inc.

11 Weeks

784-BFBGA, FCBGA

YES

-40°C~100°C TJ

Tray

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

784

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B784

0.742V

0.698V

252

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

-

0°C~100°C TJ

Tray

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

328

533MHz, 1.3GHz

256KB

-

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

2013

yes

XCZU2EG-L1SFVC784I vs XCZU9CG-2FFVB1156E
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

-

0°C~100°C TJ

Tray

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

308

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

2016

-

XCZU2EG-L1SFVC784I vs XCZU19EG-1FFVD1760E
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

464

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

2016

-

XCZU2EG-L1SFVC784I vs XCZU7EV-2FFVF1517I