Xilinx Inc. XCZU2CG-2SFVC784I
- Part Number:
- XCZU2CG-2SFVC784I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669295-XCZU2CG-2SFVC784I
- Description:
- IC FPGA 252 I/O 784FCBGA
- Datasheet:
- XCZU2CG-2SFVC784I
Xilinx Inc. XCZU2CG-2SFVC784I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2CG-2SFVC784I.
- Factory Lead Time11 Weeks
- Package / Case784-BFBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations784
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.85V
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B784
- Number of I/O252
- Speed533MHz, 1.3GHz
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 103K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The Xilinx Inc. brand offers a powerful Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. This chip, published in 2016, boasts a package/case of 784-BFBGA, FCBGA and is surface mountable. With an operating temperature range of -40°C~100°C TJ and a moisture sensitivity level of 4 (72 hours), this chip is suitable for a variety of environments. Its CMOS technology and BALL terminal form contribute to its efficient performance. The chip's primary attributes include a Zynq®UltraScale ™ FPGA with over 103K logic cells, making it a versatile and reliable choice. Additionally, the chip is ROHS3 compliant, ensuring its environmental responsibility.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2CG-2SFVC784I System On Chip (SoC) applications.
Robotics
ARM
Sensor network-on-chip (sNoC)
Industrial automation devices
Functional safety for critical applications in the automotive
CNC control
Video Imaging
Automotive
Healthcare
Servo drive control module
The Xilinx Inc. brand offers a powerful Embedded - System On Chip (SoC) chip, belonging to the Embedded - System On Chip (SoC) category. This chip, published in 2016, boasts a package/case of 784-BFBGA, FCBGA and is surface mountable. With an operating temperature range of -40°C~100°C TJ and a moisture sensitivity level of 4 (72 hours), this chip is suitable for a variety of environments. Its CMOS technology and BALL terminal form contribute to its efficient performance. The chip's primary attributes include a Zynq®UltraScale ™ FPGA with over 103K logic cells, making it a versatile and reliable choice. Additionally, the chip is ROHS3 compliant, ensuring its environmental responsibility.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2CG-2SFVC784I System On Chip (SoC) applications.
Robotics
ARM
Sensor network-on-chip (sNoC)
Industrial automation devices
Functional safety for critical applications in the automotive
CNC control
Video Imaging
Automotive
Healthcare
Servo drive control module
XCZU2CG-2SFVC784I More Descriptions
FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 784-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, C784, RoHSXilinx SCT
IC SOC CORTEX-M3 166MHZ 536BGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, C784, RoHSXilinx SCT
IC SOC CORTEX-M3 166MHZ 536BGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU2CG-2SFVC784I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeNumber of I/OSpeedRAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeView Compare
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XCZU2CG-2SFVC784I11 Weeks784-BFBGA, FCBGAYES-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)7848542.31.00.01CMOSBOTTOMBALLNOT SPECIFIED0.85VNOT SPECIFIEDS-PBGA-B784252533MHz, 1.3GHz256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant--
-
11 Weeks1156-BBGA, FCBGA-0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)-8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED-328533MHz, 1.3GHz256KB-Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes
-
11 Weeks1760-BBGA, FCBGA-0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)-8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED-308500MHz, 600MHz, 1.2GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-
-
11 Weeks1517-BBGA, FCBGA--40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EVActive4 (72 Hours)-8542.31.00.01---NOT SPECIFIED-NOT SPECIFIED-464533MHz, 600MHz, 1.3GHz256KB-Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant-
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