Xilinx Inc. XCZU2CG-2SFVA625E
- Part Number:
- XCZU2CG-2SFVA625E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669299-XCZU2CG-2SFVA625E
- Description:
- IC FPGA 180 I/O 625FCBGA
- Datasheet:
- XCZU2CG-2SFVA625E
Xilinx Inc. XCZU2CG-2SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2CG-2SFVA625E.
- Factory Lead Time11 Weeks
- Package / Case625-BFBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O180
- Speed533MHz, 1.3GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 103K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The operating temperature range for the TJ series of the Zynq® UltraScale ™ MPSoC CG is 0°C to 100°C. This series is designed for high-performance applications with its JESD-609 code of e1. Currently, the part status is active, meaning it is readily available for use. The HTS code for this series is 8542.31.00.01, which is used for customs purposes. The reflow temperature-max (s) is not specified, so caution should be taken when using this series in high-temperature environments. The speed of this series ranges from 533MHz to 1.3GHz, making it suitable for a variety of applications. With a RAM size of 256KB, this series offers ample memory for data processing. It also offers a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This series is designed with a combination of MCU and FPGA architecture, making it a versatile and powerful choice for various applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2CG-2SFVA625E System On Chip (SoC) applications.
Optical drive
Sensor network-on-chip (sNoC)
Central alarm system
Temperature Sensors
Healthcare
Communication interfaces ( I2C, SPI )
AC-input BLDC motor drive
Functional safety for critical applications in the aerospace
High-end PLC
Video Imaging
The operating temperature range for the TJ series of the Zynq® UltraScale ™ MPSoC CG is 0°C to 100°C. This series is designed for high-performance applications with its JESD-609 code of e1. Currently, the part status is active, meaning it is readily available for use. The HTS code for this series is 8542.31.00.01, which is used for customs purposes. The reflow temperature-max (s) is not specified, so caution should be taken when using this series in high-temperature environments. The speed of this series ranges from 533MHz to 1.3GHz, making it suitable for a variety of applications. With a RAM size of 256KB, this series offers ample memory for data processing. It also offers a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This series is designed with a combination of MCU and FPGA architecture, making it a versatile and powerful choice for various applications.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2CG-2SFVA625E System On Chip (SoC) applications.
Optical drive
Sensor network-on-chip (sNoC)
Central alarm system
Temperature Sensors
Healthcare
Communication interfaces ( I2C, SPI )
AC-input BLDC motor drive
Functional safety for critical applications in the aerospace
High-end PLC
Video Imaging
XCZU2CG-2SFVA625E More Descriptions
FPGA XCZU2CG Family 103320 Logic Units 103320 Cells 775MHz 16nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, A625, RoHSXilinx SCT
IC SOC CORTEX-A9 667MHZ 484FCBGA
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, A625, RoHSXilinx SCT
IC SOC CORTEX-A9 667MHZ 484FCBGA
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU2CG-2SFVA625E.
-
ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishHTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusView Compare
-
XCZU2CG-2SFVA625E11 Weeks625-BFBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGe1yesActive4 (72 Hours)Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant-
-
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CG-yesActive4 (72 Hours)-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant
-
11 Weeks900-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV--Active4 (72 Hours)-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
-
11 Weeks1517-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV--Active4 (72 Hours)-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED464533MHz, 600MHz, 1.3GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliant
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
10 April 2024
STM32F103CBT6 Microcontroller Features, Application and STM32F103CBT6 vs CKS32F103C8T6
Ⅰ. Description of STM32F103CBT6Ⅱ. Low-power modes of STM32F103CBT6Ⅲ. Functional features of STM32F103CBT6Ⅳ. Application fields of STM32F103CBT6Ⅴ. GPIO attributes and configuration process of STM32F103CBT6Ⅵ. How to program and debug... -
11 April 2024
A Complete Guide to IR2104 Half-Bridge Driver
Ⅰ. IR2104 descriptionⅡ. IR2104 half-bridge driver circuit characteristicsⅢ. IR2104 half-bridge driver working principleⅣ. Practical application of IR2104Ⅴ. Recommended operating conditions of IR2104Ⅵ. What are the heat dissipation measures... -
11 April 2024
74LS138 Decoder Working Principle, Application Scenarios and 7AHC138 vs 74LS138
Ⅰ. Introduction to 74LS138Ⅱ. What is the meaning of the 74LS138 naming?Ⅲ. Working principle of 74LS138Ⅳ. Example of application circuit diagram of 74LS138Ⅴ. Application scenarios of 74LS138 decoderⅥ.... -
12 April 2024
L298N DC Motor Drive Module: Features, Pinout, Usage and Application
Ⅰ. Introduction to L298NⅡ. Functional features of L298NⅢ. L298N circuit diagramⅣ. Control method of L298NⅤ. Pin diagram and functions of L298NⅥ. How to use L298N?Ⅶ. How to use...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.