XCZU2CG-2SFVA625E

Xilinx Inc. XCZU2CG-2SFVA625E

Part Number:
XCZU2CG-2SFVA625E
Manufacturer:
Xilinx Inc.
Ventron No:
3669299-XCZU2CG-2SFVA625E
Description:
IC FPGA 180 I/O 625FCBGA
ECAD Model:
Datasheet:
XCZU2CG-2SFVA625E

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Specifications
Xilinx Inc. XCZU2CG-2SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2CG-2SFVA625E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    625-BFBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    180
  • Speed
    533MHz, 1.3GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The operating temperature range for the TJ series of the Zynq® UltraScale ™ MPSoC CG is 0°C to 100°C. This series is designed for high-performance applications with its JESD-609 code of e1. Currently, the part status is active, meaning it is readily available for use. The HTS code for this series is 8542.31.00.01, which is used for customs purposes. The reflow temperature-max (s) is not specified, so caution should be taken when using this series in high-temperature environments. The speed of this series ranges from 533MHz to 1.3GHz, making it suitable for a variety of applications. With a RAM size of 256KB, this series offers ample memory for data processing. It also offers a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This series is designed with a combination of MCU and FPGA architecture, making it a versatile and powerful choice for various applications.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU2CG-2SFVA625E System On Chip (SoC) applications.

Optical drive
Sensor network-on-chip (sNoC)
Central alarm system
Temperature Sensors
Healthcare
Communication interfaces ( I2C, SPI )
AC-input BLDC motor drive
Functional safety for critical applications in the aerospace
High-end PLC
Video Imaging
XCZU2CG-2SFVA625E More Descriptions
FPGA XCZU2CG Family 103320 Logic Units 103320 Cells 775MHz 16nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 103K, A625, RoHSXilinx SCT
IC SOC CORTEX-A9 667MHZ 484FCBGA
FPGA - Field Programmable Gate Array
Product Comparison
The three parts on the right have similar specifications to XCZU2CG-2SFVA625E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    View Compare
  • XCZU2CG-2SFVA625E
    XCZU2CG-2SFVA625E
    11 Weeks
    625-BFBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    e1
    yes
    Active
    4 (72 Hours)
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    -
    yes
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    328
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
  • XCZU7EV-1FBVB900E
    11 Weeks
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    -
    -
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    -
    -
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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