XCZU2CG-1SFVA625E

Xilinx Inc. XCZU2CG-1SFVA625E

Part Number:
XCZU2CG-1SFVA625E
Manufacturer:
Xilinx Inc.
Ventron No:
3669422-XCZU2CG-1SFVA625E
Description:
IC FPGA 180 I/O 625FCBGA
ECAD Model:
Datasheet:
XCZU2CG-1SFVA625E

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XCZU2CG-1SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2CG-1SFVA625E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    625-BFBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC CG
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • HTS Code
    8542.31.00.01
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Number of I/O
    180
  • Speed
    500MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The packaging of the product is a tray and it was published in 2016 as part of the Zynq® UltraScale ™ MPSoC CG series. The part status is active, indicating that it is currently available for purchase. It has a moisture sensitivity level (MSL) of 4, which means it can withstand exposure to moisture for up to 72 hours. The speed of the product ranges from 500MHz to 1.2GHz. The core processor consists of a dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and a dual ARM® Cortex™-R5 with CoreSight™. The connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The primary attributes of this product include the Zynq® UltraScale ™ FPGA with over 103K logic cells. Lastly, it is important to note that this product is ROHS3 compliant, meaning it meets the European Union's Restriction of Hazardous Substances Directive.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU2CG-1SFVA625E System On Chip (SoC) applications.

Efficient hardware for inference of neural networks
String inverter
Microcontroller based SoC ( RISC-V, ARM)
Digital Signal Processing
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
Automated sorting equipment
Smartphones
ARM processors
Mobile computing
XCZU2CG-1SFVA625E More Descriptions
FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 103K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-625
IC SOC CORTEX-M3 166MHZ 676FBGA
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-625; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:625Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU2CG-1SFVA625E
Product Comparison
The three parts on the right have similar specifications to XCZU2CG-1SFVA625E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    HTS Code
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Pbfree Code
    Surface Mount
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    uPs/uCs/Peripheral ICs Type
    View Compare
  • XCZU2CG-1SFVA625E
    XCZU2CG-1SFVA625E
    11 Weeks
    625-BFBGA, FCBGA
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC CG
    e1
    Active
    4 (72 Hours)
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 1.2GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU9CG-2FFVB1156E
    11 Weeks
    1156-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2013
    Zynq® UltraScale ™ MPSoC CG
    -
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    328
    533MHz, 1.3GHz
    256KB
    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 599K Logic Cells
    ROHS3 Compliant
    yes
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCZU5EV-L1FBVB900I
    11 Weeks
    900-BBGA, FCBGA
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    -
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    204
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 256K Logic Cells
    ROHS3 Compliant
    -
    YES
    900
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B900
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    -
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    NOT SPECIFIED
    NOT SPECIFIED
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    -
    YES
    625
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    CMOS
    BOTTOM
    BALL
    0.72V
    R-PBGA-B625
    0.742V
    0.698V
    MICROPROCESSOR CIRCUIT
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.