Xilinx Inc. XCZU2CG-1SFVA625E
- Part Number:
- XCZU2CG-1SFVA625E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3669422-XCZU2CG-1SFVA625E
- Description:
- IC FPGA 180 I/O 625FCBGA
- Datasheet:
- XCZU2CG-1SFVA625E
Xilinx Inc. XCZU2CG-1SFVA625E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU2CG-1SFVA625E.
- Factory Lead Time11 Weeks
- Package / Case625-BFBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC CG
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O180
- Speed500MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 103K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
The packaging of the product is a tray and it was published in 2016 as part of the Zynq® UltraScale ™ MPSoC CG series. The part status is active, indicating that it is currently available for purchase. It has a moisture sensitivity level (MSL) of 4, which means it can withstand exposure to moisture for up to 72 hours. The speed of the product ranges from 500MHz to 1.2GHz. The core processor consists of a dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and a dual ARM® Cortex™-R5 with CoreSight™. The connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The primary attributes of this product include the Zynq® UltraScale ™ FPGA with over 103K logic cells. Lastly, it is important to note that this product is ROHS3 compliant, meaning it meets the European Union's Restriction of Hazardous Substances Directive.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2CG-1SFVA625E System On Chip (SoC) applications.
Efficient hardware for inference of neural networks
String inverter
Microcontroller based SoC ( RISC-V, ARM)
Digital Signal Processing
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
Automated sorting equipment
Smartphones
ARM processors
Mobile computing
The packaging of the product is a tray and it was published in 2016 as part of the Zynq® UltraScale ™ MPSoC CG series. The part status is active, indicating that it is currently available for purchase. It has a moisture sensitivity level (MSL) of 4, which means it can withstand exposure to moisture for up to 72 hours. The speed of the product ranges from 500MHz to 1.2GHz. The core processor consists of a dual ARM® Cortex®-A53 MPCore™ with CoreSight™ and a dual ARM® Cortex™-R5 with CoreSight™. The connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The primary attributes of this product include the Zynq® UltraScale ™ FPGA with over 103K logic cells. Lastly, it is important to note that this product is ROHS3 compliant, meaning it meets the European Union's Restriction of Hazardous Substances Directive.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU2CG-1SFVA625E System On Chip (SoC) applications.
Efficient hardware for inference of neural networks
String inverter
Microcontroller based SoC ( RISC-V, ARM)
Digital Signal Processing
Functional safety for critical applications in the automotive
Communication network-on-Chip (cNoC)
Automated sorting equipment
Smartphones
ARM processors
Mobile computing
XCZU2CG-1SFVA625E More Descriptions
FPGA Zynq UltraScale Family 103320 Cells 20nm Technology 0.85V 625-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 103K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-625
IC SOC CORTEX-M3 166MHZ 676FBGA
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-625; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:625Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU2CG-1SFVA625E
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 103K, A625, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA625
MPSOC, ARM CORTEX-A53, 1.3GHZ, FCBGA-625
IC SOC CORTEX-M3 166MHZ 676FBGA
FPGA - Field Programmable Gate Array
Mpsoc, Arm Cortex-A53, 1.3Ghz, Fcbga-625; Product Range:Zynq Family Ultrascale Cg Series Microprocessors; Cpu Speed:1.3Ghz; Core Architecture:Arm Cortex-A53; Mpu Case Style:Fcbga; No. Of Pins:625Pins; Msl:-; Ic Case/Package:Fcbga Rohs Compliant: Yes |Amd Xilinx XCZU2CG-1SFVA625E
The three parts on the right have similar specifications to XCZU2CG-1SFVA625E.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishHTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeSurface MountNumber of TerminationsAdditional FeatureTechnologyTerminal PositionTerminal FormSupply VoltageJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)uPs/uCs/Peripheral ICs TypeView Compare
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XCZU2CG-1SFVA625E11 Weeks625-BFBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGe1Active4 (72 Hours)Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 1.2GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant-------------
-
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC CG-Active4 (72 Hours)-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliantyes-----------
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EV-Active4 (72 Hours)-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 256K Logic CellsROHS3 Compliant-YES900ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B9000.742V0.698VMICROPROCESSOR CIRCUIT
-
11 Weeks625-BFBGA, FCBGA-40°C~100°C TJTray-Zynq® UltraScale ™ MPSoC EG-Active4 (72 Hours)-8542.31.00.01NOT SPECIFIEDNOT SPECIFIED180500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 103K Logic CellsROHS3 Compliant-YES625ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLYCMOSBOTTOMBALL0.72VR-PBGA-B6250.742V0.698VMICROPROCESSOR CIRCUIT
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