XCZU19EG-L2FFVB1517E

Xilinx Inc. XCZU19EG-L2FFVB1517E

Part Number:
XCZU19EG-L2FFVB1517E
Manufacturer:
Xilinx Inc.
Ventron No:
4544170-XCZU19EG-L2FFVB1517E
Description:
IC FPGA 644 I/O 1517FCBGA
ECAD Model:
Datasheet:
XCZU19EG-L2FFVB1517E

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Specifications
Xilinx Inc. XCZU19EG-L2FFVB1517E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU19EG-L2FFVB1517E.
  • Factory Lead Time
    11 Weeks
  • Package / Case
    1517-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2016
  • Series
    Zynq® UltraScale ™ MPSoC EG
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Additional Feature
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.72V
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B1517
  • Supply Voltage-Max (Vsup)
    0.742V
  • Supply Voltage-Min (Vsup)
    0.698V
  • Number of I/O
    644
  • Speed
    533MHz, 600MHz, 1.3GHz
  • RAM Size
    256KB
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Primary Attributes
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
  • RoHS Status
    ROHS3 Compliant
Description
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Zynq® UltraScale ™ MPSoC EG series offers a variety of options for package and case, including 1517-BBGA and FCBGA, making it suitable for surface mount applications. With a supply voltage-min of 0.698V, this architecture is capable of operating at speeds of 533MHz, 600MHz, and 1.3GHz. An additional feature of this series is the availability of a 0.85V nominal supply, providing even more flexibility for designers. However, the reflow temperature-max (s) is not specified, so careful consideration must be taken during the assembly process. With a JESD-30 code of R-PBGA-B1517, this MCU and FPGA combination offers 1143K logic cells, making it a powerful and versatile option for a wide range of applications.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU19EG-L2FFVB1517E System On Chip (SoC) applications.

Mobile computing
Networked sensors
Efficient hardware for inference of neural networks
Communication network-on-Chip (cNoC)
Automotive
sequence controllers
Video Imaging
Microprocessors
PC peripherals
Body control module
XCZU19EG-L2FFVB1517E More Descriptions
Zynq UltraScale RFSoC, Speed Grade-L2, Logic Cells 1143K, B1517, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1517
FPGA - Field Programmable Gate Array
Xilinx Commercial Zynq UltraScale 1143450 System Logic Cells 1045440 CLB Flip-Flops 34.6Mbyte RAM 644 I/O 1V to 3.3V Supply Voltage Quad APU/Dual RPU/Single GPU Surface Mount 1517-Ball FPBGA Tray
Product Comparison
The three parts on the right have similar specifications to XCZU19EG-L2FFVB1517E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Additional Feature
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Primary Attributes
    RoHS Status
    Number of Terminations
    View Compare
  • XCZU19EG-L2FFVB1517E
    XCZU19EG-L2FFVB1517E
    11 Weeks
    1517-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B1517
    0.742V
    0.698V
    644
    533MHz, 600MHz, 1.3GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
    -
  • XCZU2EG-L1SFVA625I
    11 Weeks
    625-BFBGA, FCBGA
    YES
    -40°C~100°C TJ
    Tray
    -
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    0.72V
    NOT SPECIFIED
    R-PBGA-B625
    0.742V
    0.698V
    180
    500MHz, 600MHz, 1.2GHz
    256KB
    MICROPROCESSOR CIRCUIT
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 103K Logic Cells
    ROHS3 Compliant
    625
  • XCZU19EG-1FFVD1760E
    11 Weeks
    1760-BBGA, FCBGA
    -
    0°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EG
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    308
    500MHz, 600MHz, 1.2GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 1143K Logic Cells
    ROHS3 Compliant
    -
  • XCZU7EV-2FFVF1517I
    11 Weeks
    1517-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    2016
    Zynq® UltraScale ™ MPSoC EV
    Active
    4 (72 Hours)
    -
    8542.31.00.01
    -
    -
    -
    NOT SPECIFIED
    -
    NOT SPECIFIED
    -
    -
    -
    464
    533MHz, 600MHz, 1.3GHz
    256KB
    -
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
    DMA, WDT
    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    MCU, FPGA
    Zynq®UltraScale ™ FPGA, 504K Logic Cells
    ROHS3 Compliant
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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