Xilinx Inc. XCZU19EG-1FFVE1924E

Name: XCZU19EG-1FFVE1924E
Brand: Xilinx Inc.
SKU: 3828161-XCZU19EG-1FFVE1924E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU19EG-1FFVE1924E

Manufacturer:: Xilinx Inc.

Ventron No:: 3828161-XCZU19EG-1FFVE1924E

Description:: IC FPGA 668 I/O 1924FCBGA

ECAD Model:

Datasheet:: XCZU19EG-1FFVE1924E

Specifications

Xilinx Inc. XCZU19EG-1FFVE1924E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU19EG-1FFVE1924E.

Factory Lead Time
11 Weeks
Package / Case
1924-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
668
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 1143K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The product parameters for our latest offering include an operating temperature range of 0°C to 100°C, making it suitable for a wide range of industrial and commercial applications. The product is packaged in trays, ensuring safe and efficient handling during transportation and storage. With a Moisture Sensitivity Level (MSL) of 4, the product can withstand up to 72 hours of exposure to moisture without any adverse effects. The Peak Reflow Temperature and Reflow Temperature-Max are not specified, providing flexibility for customers to customize their reflow profiles. The product boasts high-speed capabilities of 500MHz, 600MHz, and 1.2GHz, coupled with a 256KB RAM size. It also offers a range of peripherals such as DMA and WDT, and connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The product architecture is a combination of MCU and FPGA, providing a powerful and versatile solution for various design needs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU19EG-1FFVE1924E System On Chip (SoC) applications.

Samsung galaxy gear
String inverter
POS Terminals
POS Terminals
Mobile market
Test and Measurement
Functional safety for critical applications in the aerospace
Special Issue Information
Embedded systems
Video Imaging

XCZU19EG-1FFVE1924E More Descriptions

Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 1143K, E1924, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1924
Zynq UltraScale FPGA 1143450 System Logic Cells 1045440 CLB Flip-Flops 522720 CLB LUTs Extended Temperature Grade 1924-Pin FCBGA Tray
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU19EG-1FFVE1924E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU19EG-1FFVE1924E

Xilinx Inc.

11 Weeks

1924-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

668

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

-

-

-

-

-

-

-

-

-

-

-

XCZU19EG-1FFVE1924E vs XCZU9CG-2FFVB1156E
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

-

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU19EG-1FFVE1924E vs XCZU2EG-L1SFVA625I
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

XCZU19EG-1FFVE1924E vs XCZU7EV-1FBVB900E