Xilinx Inc. XCZU15EG-L1FFVB1156I

Name: XCZU15EG-L1FFVB1156I
Brand: Xilinx Inc.
SKU: 3163058-XCZU15EG-L1FFVB1156I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU15EG-L1FFVB1156I

Manufacturer:: Xilinx Inc.

Ventron No:: 3163058-XCZU15EG-L1FFVB1156I

Description:: IC FPGA 328 I/O 1156FCBGA

ECAD Model:

Datasheet:: XCZU15EG-L1FFVB1156I

Specifications

Xilinx Inc. XCZU15EG-L1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU15EG-L1FFVB1156I.

Factory Lead Time
11 Weeks
Package / Case
1156-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Additional Feature
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.72V
Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PBGA-B1156
Supply Voltage-Max (Vsup)
0.742V
Supply Voltage-Min (Vsup)
0.698V
Number of I/O
328
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 747K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Xilinx Inc. brand offers a high-quality Embedded - System On Chip (SoC) chip that falls under the Embedded - System On Chip (SoC) category. This chip is surface mountable and has an operating temperature range of -40°C to 100°C TJ. It is packaged in a tray and has an HTS code of 8542.31.00.01. The peak reflow temperature is not specified, and the supply voltage-max is 0.742V. The chip features a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2 core processors, along with peripherals such as DMA and WDT. Its architecture includes both MCU and FPGA components, and it is also ROHS3 compliant.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.
XCZU15EG-L1FFVB1156I System On Chip (SoC) applications.

Deep learning hardware
Industrial AC-DC
CNC control
Mouse
Wireless sensor networks
Functional safety for critical applications in the aerospace
Robotics
Medical
DC-input BLDC motor drive
Samsung galaxy gear

XCZU15EG-L1FFVB1156I More Descriptions

Zynq UltraScale RFSoC, Speed Grade-L1, Logic Cells 747K, B1156, RoHSXilinx SCT
FPGA XCZU15EG Family 746550 Logic Units 746550 Cells 645MHz 16nm Technology 0.72V/0.85V 1156-Pin FCBGA Tray
Microprocessor Circuit, CMOS, PBGA1156
Product Description Demo for Development.
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU15EG-L1FFVB1156I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Surface Mount

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Number of I/O

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

View Compare
XCZU15EG-L1FFVB1156I

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

YES

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B1156

0.742V

0.698V

328

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 747K Logic Cells

ROHS3 Compliant

-
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

XCZU15EG-L1FFVB1156I vs XCZU7EV-1FBVB900E
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

204

500MHz, 600MHz, 1.2GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

XCZU15EG-L1FFVB1156I vs XCZU9EG-1FFVC900I
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

-

8542.31.00.01

-

-

-

NOT SPECIFIED

-

NOT SPECIFIED

-

-

-

464

533MHz, 600MHz, 1.3GHz

256KB

-

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

XCZU15EG-L1FFVB1156I vs XCZU7EV-2FFVF1517I