Xilinx Inc. XCZU15EG-1FFVB1156I
- Part Number:
- XCZU15EG-1FFVB1156I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3163095-XCZU15EG-1FFVB1156I
- Description:
- IC FPGA 328 I/O 1156FCBGA
- ECAD Model:
-
- Datasheet:
- XCZU15EG-1FFVB1156I
Xilinx Inc. XCZU15EG-1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU15EG-1FFVB1156I.
- Factory Lead Time11 Weeks
- Package / Case1156-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2016
- SeriesZynq® UltraScale ™ MPSoC EG
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- HTS Code8542.31.00.01
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of I/O328
- Speed500MHz, 600MHz, 1.2GHz
- RAM Size256KB
- Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- PeripheralsDMA, WDT
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Primary AttributesZynq®UltraScale ™ FPGA, 747K Logic Cells
- RoHS StatusROHS3 Compliant
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
Xilinx Inc. is the brand of this part, which is an Embedded - System On Chip (SoC) chip in the Embedded - System On Chip (SoC) category. The package/case is 1156-BBGA, FCBGA and the packaging is Tray. It was published in 2016 and belongs to the Zynq® UltraScale ™ MPSoC EG series. The chip's speed options are 500MHz, 600MHz, and 1.2GHz and it has a RAM size of 256KB. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip's architecture is a combination of MCU and FPGA, with its primary attribute being the Zynq® UltraScale ™ FPGA which has over 747K logic cells. It is also ROHS3 compliant.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU15EG-1FFVB1156I System On Chip (SoC) applications.
Special Issue Editors
Automotive
Embedded systems
Industrial automation devices
Optical drive
Wireless networking
Microprocessors
Functional safety for critical applications in the automotive
ARM processors
DC-input BLDC motor drive
Xilinx Inc. is the brand of this part, which is an Embedded - System On Chip (SoC) chip in the Embedded - System On Chip (SoC) category. The package/case is 1156-BBGA, FCBGA and the packaging is Tray. It was published in 2016 and belongs to the Zynq® UltraScale ™ MPSoC EG series. The chip's speed options are 500MHz, 600MHz, and 1.2GHz and it has a RAM size of 256KB. Its connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This chip's architecture is a combination of MCU and FPGA, with its primary attribute being the Zynq® UltraScale ™ FPGA which has over 747K logic cells. It is also ROHS3 compliant.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU15EG-1FFVB1156I System On Chip (SoC) applications.
Special Issue Editors
Automotive
Embedded systems
Industrial automation devices
Optical drive
Wireless networking
Microprocessors
Functional safety for critical applications in the automotive
ARM processors
DC-input BLDC motor drive
XCZU15EG-1FFVB1156I More Descriptions
FPGA Zynq UltraScale Family 746550 Cells 20nm Technology 0.85V 1156-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 747K, B1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
Zynq UltraScale RFSoC, Speed Grade-1, Logic Cells 747K, B1156, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
The three parts on the right have similar specifications to XCZU15EG-1FFVB1156I.
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ImagePart NumberManufacturerFactory Lead TimePackage / CaseOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)HTS CodePeak Reflow Temperature (Cel)Reflow Temperature-Max (s)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesRoHS StatusPbfree CodeView Compare
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XCZU15EG-1FFVB1156I11 Weeks1156-BBGA, FCBGA-40°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED328500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 747K Logic CellsROHS3 Compliant-- -
11 Weeks1156-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC CGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED360533MHz, 1.3GHz256KBDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 504K Logic CellsROHS3 Compliantyes
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11 Weeks900-BBGA, FCBGA-40°C~100°C TJTray2013Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED204500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 599K Logic CellsROHS3 Compliant-
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11 Weeks1760-BBGA, FCBGA0°C~100°C TJTray2016Zynq® UltraScale ™ MPSoC EGActive4 (72 Hours)8542.31.00.01NOT SPECIFIEDNOT SPECIFIED308500MHz, 600MHz, 1.2GHz256KBQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2DMA, WDTCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGAZynq®UltraScale ™ FPGA, 1143K Logic CellsROHS3 Compliant-
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