Xilinx Inc. XCZU11EG-2FFVC1760E

Name: XCZU11EG-2FFVC1760E
Brand: Xilinx Inc.
SKU: 3669076-XCZU11EG-2FFVC1760E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU11EG-2FFVC1760E

Manufacturer:: Xilinx Inc.

Ventron No:: 3669076-XCZU11EG-2FFVC1760E

Description:: IC FPGA 512 I/O 1760FCBGA

ECAD Model:

Datasheet:: XCZU11EG-2FFVC1760E

Specifications

Xilinx Inc. XCZU11EG-2FFVC1760E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU11EG-2FFVC1760E.

Factory Lead Time
11 Weeks
Package / Case
1760-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
512
Speed
533MHz, 600MHz, 1.3GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 653K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The specific part being referred to is manufactured by Xilinx Inc. and falls under the category of Embedded - System On Chip (SoC) chips. It is a member of the Embedded - System On Chip (SoC) category and is identified by the brand name Xilinx Inc. The package or case size for this part is 1760-BBGA or FCBGA, and it is packaged in a tray. This particular part was first published in 2016 and belongs to the Zynq® UltraScale ™ MPSoC EG series. It is compliant with Pbfree regulations and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand exposure to moisture for up to 72 hours. The reflow temperature of this part is not specified. It has a speed of 533MHz, 600MHz, or 1.3GHz and has a dual architecture of both MCU and FPGA. This part is also compliant with the RoHS3 regulations.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU11EG-2FFVC1760E System On Chip (SoC) applications.

Defense
Self-aware system-on-chip (SoC)
Smartphones
Industrial robot
Sensor network-on-chip (sNoC)
Deep learning hardware
DC-input BLDC motor drive
Central alarm system
AC drive control module
RISC-V

XCZU11EG-2FFVC1760E More Descriptions

FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray
Zynq UltraScale RFSoC, Speed Grade-2, Logic Cells 653K, C1760, RoHSXilinx SCT
Microprocessor Circuit, CMOS, PBGA1156
IC BILATERAL SWITCH QUAD 14-DIP
FPGA - Field Programmable Gate Array

Product Comparison

The three parts on the right have similar specifications to XCZU11EG-2FFVC1760E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU11EG-2FFVC1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

yes

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

512

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 653K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-
XCZU2EG-L1SFVA625I

Xilinx Inc.

11 Weeks

625-BFBGA, FCBGA

-40°C~100°C TJ

Tray

-

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

180

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 103K Logic Cells

ROHS3 Compliant

YES

625

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B625

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU11EG-2FFVC1760E vs XCZU2EG-L1SFVA625I
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU11EG-2FFVC1760E vs XCZU9EG-1FFVC900I
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

-

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

XCZU11EG-2FFVC1760E vs XCZU7EV-2FFVF1517I