Xilinx Inc. XCZU11EG-1FFVC1760E

Name: XCZU11EG-1FFVC1760E
Brand: Xilinx Inc.
SKU: 3828064-XCZU11EG-1FFVC1760E
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU11EG-1FFVC1760E

Manufacturer:: Xilinx Inc.

Ventron No:: 3828064-XCZU11EG-1FFVC1760E

Description:: IC FPGA 512 I/O 1760FCBGA

ECAD Model:

Datasheet:: XCZU11EG-1FFVC1760E

Specifications

Xilinx Inc. XCZU11EG-1FFVC1760E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU11EG-1FFVC1760E.

Factory Lead Time
11 Weeks
Package / Case
1760-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
512
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 653K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Zynq® UltraScale ™ MPSoC EG is a high-performance and versatile product with a wide operating temperature range of 0°C to 100°C. It was first published in 2016 and belongs to the Zynq® UltraScale ™ series. This product has a Moisture Sensitivity Level (MSL) of 4, which means it can withstand exposure to high humidity levels for up to 72 hours. It falls under HTS Code 8542.31.00.01 and has a total of 512 I/Os. The RAM size is 256KB and it features peripherals such as DMA and WDT. The product offers multiple connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Its primary attributes include the Zynq® UltraScale ™ FPGA, which boasts 653K logic cells.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU11EG-1FFVC1760E System On Chip (SoC) applications.

Transmitters
Keywords
Industrial
Healthcare
Apple smart watch
Functional safety for critical applications in the industrial sectors
Vending machines
Sensor network-on-chip (sNoC)
Robotics
Industrial robot

XCZU11EG-1FFVC1760E More Descriptions

FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.95V 1760-Pin FCBGA Tray
IC SOC CORTEX-A53 1760FCBGA

Product Comparison

The three parts on the right have similar specifications to XCZU11EG-1FFVC1760E.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

View Compare
XCZU11EG-1FFVC1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

512

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 653K Logic Cells

ROHS3 Compliant

-
XCZU7EV-1FBVB900E

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

XCZU11EG-1FFVC1760E vs XCZU7EV-1FBVB900E
XCZU19EG-1FFVD1760E

Xilinx Inc.

11 Weeks

1760-BBGA, FCBGA

0°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

308

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 1143K Logic Cells

ROHS3 Compliant

XCZU11EG-1FFVC1760E vs XCZU19EG-1FFVD1760E
XCZU7EV-2FFVF1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

464

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 504K Logic Cells

ROHS3 Compliant

XCZU11EG-1FFVC1760E vs XCZU7EV-2FFVF1517I