Xilinx Inc. XCZU11EG-1FFVB1517I

Name: XCZU11EG-1FFVB1517I
Brand: Xilinx Inc.
SKU: 3828075-XCZU11EG-1FFVB1517I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCZU11EG-1FFVB1517I

Manufacturer:: Xilinx Inc.

Ventron No:: 3828075-XCZU11EG-1FFVB1517I

Description:: IC FPGA 488 I/O 1517FCBGA

ECAD Model:

Datasheet:: XCZU11EG-1FFVB1517I

Specifications

Xilinx Inc. XCZU11EG-1FFVB1517I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCZU11EG-1FFVB1517I.

Factory Lead Time
11 Weeks
Package / Case
1517-BBGA, FCBGA
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2016
Series
Zynq® UltraScale ™ MPSoC EG
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
HTS Code
8542.31.00.01
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
488
Speed
500MHz, 600MHz, 1.2GHz
RAM Size
256KB
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Zynq®UltraScale ™ FPGA, 653K Logic Cells
RoHS Status
ROHS3 Compliant

Description

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
The Xilinx Inc. brand offers a high-performance solution with their Embedded - System On Chip (SoC) chip, part of the Embedded - System On Chip (SoC) category. This chip has an operating temperature range of -40°C~100°C TJ and is packaged in a tray. Released in 2016, this chip belongs to the Zynq® UltraScale ™ MPSoC EG series and has a Moisture Sensitivity Level (MSL) of 4 (72 Hours). It can operate at speeds of 500MHz, 600MHz, and 1.2GHz and has a RAM size of 256KB. The core processor of this chip is a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, along with a Dual ARM® Cortex™-R5 with CoreSight™ and ARM Mali™-400 MP2.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.
XCZU11EG-1FFVB1517I System On Chip (SoC) applications.

AC-input BLDC motor drive
Print Special Issue Flyer
Body control module
Digital Signal Processing
Published Paper
External USB hard disk/SSD
Cyberphysical system-on-chip
Vending machines
Measurement tools
Industrial automation devices

XCZU11EG-1FFVB1517I More Descriptions

FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1517-Pin FCBGA Tray
IC SOC CORTEX-A53 1517FCBGA

Product Comparison

The three parts on the right have similar specifications to XCZU11EG-1FFVB1517I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

HTS Code

Peak Reflow Temperature (Cel)

Reflow Temperature-Max (s)

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Primary Attributes

RoHS Status

Pbfree Code

Surface Mount

Number of Terminations

Additional Feature

Technology

Terminal Position

Terminal Form

Supply Voltage

JESD-30 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

uPs/uCs/Peripheral ICs Type

View Compare
XCZU11EG-1FFVB1517I

Xilinx Inc.

11 Weeks

1517-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

488

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 653K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XCZU9CG-2FFVB1156E

Xilinx Inc.

11 Weeks

1156-BBGA, FCBGA

0°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

328

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

yes

-

-

-

-

-

-

-

-

-

-

-

XCZU11EG-1FFVB1517I vs XCZU9CG-2FFVB1156E
XCZU5EV-L1FBVB900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale ™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 256K Logic Cells

ROHS3 Compliant

-

YES

900

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

CMOS

BOTTOM

BALL

0.72V

R-PBGA-B900

0.742V

0.698V

MICROPROCESSOR CIRCUIT

XCZU11EG-1FFVB1517I vs XCZU5EV-L1FBVB900I
XCZU9EG-1FFVC900I

Xilinx Inc.

11 Weeks

900-BBGA, FCBGA

-40°C~100°C TJ

Tray

2013

Zynq® UltraScale ™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

204

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale ™ FPGA, 599K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

XCZU11EG-1FFVB1517I vs XCZU9EG-1FFVC900I