Microsemi Corporation M2S090-1FGG676I
- Part Number:
- M2S090-1FGG676I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669291-M2S090-1FGG676I
- Description:
- IC FPGA SOC 90K LUTS 676FBGA
Microsemi Corporation M2S090-1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090-1FGG676I.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- Terminal FinishMatte Tin (Sn)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Frequency166MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberM2S090
- JESD-30 CodeS-PBGA-B676
- Number of Outputs425
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O425
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs425
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Primary AttributesFPGA - 90K Logic Modules
- Number of Logic Cells86316
- Flash Size512KB
- Height Seated (Max)2.44mm
- Length27mm
- Width27mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 676-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.In addition, this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 425.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 676 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 425 inputs is available to the user.The logic SoC features 86316 logic cells.As for its flash size, it is 512KB.M2S090 will give you system on chips with similar specifications and purposes.It operates at a frequency of 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-1FGG676I System On Chip (SoC) applications.
Networked sensors
Functional safety for critical applications in the aerospace
Functional safety for critical applications in the industrial sectors
System-on-chip (SoC)
Flow Sensors
Industrial Pressure
Industrial automation devices
Test and Measurement
DC-input BLDC motor drive
String inverter
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 676-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.In addition, this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 425.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 676 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 425 inputs is available to the user.The logic SoC features 86316 logic cells.As for its flash size, it is 512KB.M2S090 will give you system on chips with similar specifications and purposes.It operates at a frequency of 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090-1FGG676I System On Chip (SoC) applications.
Networked sensors
Functional safety for critical applications in the aerospace
Functional safety for critical applications in the industrial sectors
System-on-chip (SoC)
Flow Sensors
Industrial Pressure
Industrial automation devices
Test and Measurement
DC-input BLDC motor drive
String inverter
M2S090-1FGG676I More Descriptions
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray
M2S090-1Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090-1FGG676I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
M2S090-1Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090-1FGG676I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
The three parts on the right have similar specifications to M2S090-1FGG676I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypeCore ArchitecturePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSpeedView Compare
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M2S090-1FGG676I8 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)676-BGAYES-40°C~100°C TJTray2009SmartFusion®2e3Active3 (168 Hours)676Matte Tin (Sn)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm166MHzNOT SPECIFIEDM2S090S-PBGA-B676425Not Qualified1.26V1.2V1.14VCAN, Ethernet, I2C, SPI, UART, USART, USB42564KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA425FIELD PROGRAMMABLE GATE ARRAYARMFPGA - 90K Logic Modules86316512KB2.44mm27mm27mmRoHS Compliant--
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)676-BGAYES0°C~85°C TJTray-SmartFusion®2e3Active3 (168 Hours)676MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIED-S-PBGA-B676387Not Qualified1.26V1.2V1.14V-38764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAY-FPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant166MHz
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)144-LQFPYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSQUADGULL WINGNOT SPECIFIED1.2V0.5mm-NOT SPECIFIED-S-PQFP-G14484Not Qualified1.26V1.2V1.14V-8464KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA84FIELD PROGRAMMABLE GATE ARRAY-FPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliant166MHz
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIED-S-PBGA-B896377Not Qualified1.26V1.2V1.14V-37764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAY-FPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant166MHz
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