M2S090-1FGG676I

Microsemi Corporation M2S090-1FGG676I

Part Number:
M2S090-1FGG676I
Manufacturer:
Microsemi Corporation
Ventron No:
3669291-M2S090-1FGG676I
Description:
IC FPGA SOC 90K LUTS 676FBGA
ECAD Model:
Datasheet:
SmartFusion2 Datasheet SmartFusion2 Pin Descriptions

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Specifications
Microsemi Corporation M2S090-1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090-1FGG676I.
  • Factory Lead Time
    8 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    676-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • Terminal Finish
    Matte Tin (Sn)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Frequency
    166MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    M2S090
  • JESD-30 Code
    S-PBGA-B676
  • Number of Outputs
    425
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Interface
    CAN, Ethernet, I2C, SPI, UART, USART, USB
  • Number of I/O
    425
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    425
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Core Architecture
    ARM
  • Primary Attributes
    FPGA - 90K Logic Modules
  • Number of Logic Cells
    86316
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.There is a 676-BGA package assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.In addition, this SoC security combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 425.A 1.2V power supply should be used.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.At least 1.14V can be supplied as a power source.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.Having 676 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.This system on chip SoC requires 1.2V power supply at all.A SoC chip with 425 inputs is available to the user.The logic SoC features 86316 logic cells.As for its flash size, it is 512KB.M2S090 will give you system on chips with similar specifications and purposes.It operates at a frequency of 166MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S090-1FGG676I System On Chip (SoC) applications.

Networked sensors
Functional safety for critical applications in the aerospace
Functional safety for critical applications in the industrial sectors
System-on-chip (SoC)
Flow Sensors
Industrial Pressure
Industrial automation devices
Test and Measurement
DC-input BLDC motor drive
String inverter
M2S090-1FGG676I More Descriptions
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray
M2S090-1Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090-1FGG676I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
Product Comparison
The three parts on the right have similar specifications to M2S090-1FGG676I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Core Architecture
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Speed
    View Compare
  • M2S090-1FGG676I
    M2S090-1FGG676I
    8 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    676-BGA
    YES
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    Matte Tin (Sn)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    166MHz
    NOT SPECIFIED
    M2S090
    S-PBGA-B676
    425
    Not Qualified
    1.26V
    1.2V
    1.14V
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    425
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    425
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    FPGA - 90K Logic Modules
    86316
    512KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
  • M2S060T-1FGG676
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    -
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    387
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    166MHz
  • M2S010-1TQG144
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    144-LQFP
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    -
    NOT SPECIFIED
    -
    S-PQFP-G144
    84
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    84
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    84
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    166MHz
  • M2S050T-FGG896I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    -
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    377
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    166MHz
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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