Microsemi Corporation M2S090-1FCSG325
- Part Number:
- M2S090-1FCSG325
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828194-M2S090-1FCSG325
- Description:
- IC FPGA SOC 90K LUTS
- ECAD Model:
-
- Datasheet:
- M2S090-1FCSG325
Microsemi Corporation M2S090-1FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090-1FCSG325.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case325-TFBGA, CSPBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations325
- Terminal FinishMATTE TIN
- Additional FeatureLG-MIN, WD-MIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.5mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B325
- Number of Outputs180
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O180
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs180
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 90K Logic Modules
- Number of Logic Cells86316
- Flash Size512KB
- Height Seated (Max)1.16mm
- Length13.5mm
- Width11mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The package or case for this particular product is available in 325-TFBGA and CSPBGA options. These surface mount packages make it convenient for users to mount the product onto a circuit board. The operating temperature range for this product is 0°C to 85°C, ensuring reliable performance in a wide range of environments. One of the additional features of this product is its LG-MIN and WD-MIN capabilities, providing users with more flexibility and control. The technology used in this product is CMOS, known for its low power consumption and high speed. The reflow temperature-max (s) is not specified, allowing users to customize the temperature according to their specific needs. With a RAM size of 64KB, this product is equipped with an ARM® Cortex®-M3 core processor, providing efficient and powerful processing capabilities. Additionally, it also features a field-programmable gate array, making it programmable and adaptable to different applications. The maximum seated height of this product is 1.16mm, making it compact and suitable for various space-constrained applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-1FCSG325 System On Chip (SoC) applications.
Vending machines
Mouse
Industrial AC-DC
Functional safety for critical applications in the industrial sectors
Body control module
Self-aware system-on-chip (SoC)
Measurement tools
External USB hard disk/SSD
Functional safety for critical applications in the aerospace
Optical drive
The package or case for this particular product is available in 325-TFBGA and CSPBGA options. These surface mount packages make it convenient for users to mount the product onto a circuit board. The operating temperature range for this product is 0°C to 85°C, ensuring reliable performance in a wide range of environments. One of the additional features of this product is its LG-MIN and WD-MIN capabilities, providing users with more flexibility and control. The technology used in this product is CMOS, known for its low power consumption and high speed. The reflow temperature-max (s) is not specified, allowing users to customize the temperature according to their specific needs. With a RAM size of 64KB, this product is equipped with an ARM® Cortex®-M3 core processor, providing efficient and powerful processing capabilities. Additionally, it also features a field-programmable gate array, making it programmable and adaptable to different applications. The maximum seated height of this product is 1.16mm, making it compact and suitable for various space-constrained applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-1FCSG325 System On Chip (SoC) applications.
Vending machines
Mouse
Industrial AC-DC
Functional safety for critical applications in the industrial sectors
Body control module
Self-aware system-on-chip (SoC)
Measurement tools
External USB hard disk/SSD
Functional safety for critical applications in the aerospace
Optical drive
M2S090-1FCSG325 More Descriptions
M2S090-1Fcsg325 325 Tfbga 11X13.5X1.16Mm Tray Rohs Compliant: Yes |Microchip M2S090-1FCSG325
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
The three parts on the right have similar specifications to M2S090-1FCSG325.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackagePublishedMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S090-1FCSG32510 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)325-TFBGA, CSPBGAYES0°C~85°C TJTraySmartFusion®2e3Active3 (168 Hours)325MATTE TINLG-MIN, WD-MIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDR-PBGA-B325180Not Qualified1.26V1.2V1.14V180166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA180FIELD PROGRAMMABLE GATE ARRAYFPGA - 90K Logic Modules86316512KB1.16mm13.5mm11mmRoHS Compliant--------- -
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)896MATTE TIN-8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant--------
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTraySmartFusion®2-Active3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---Non-RoHS Compliant484-FPBGA (23x23)200985°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTraySmartFusion®2-Active3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)2009100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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