Microsemi Corporation M2S060TS-1FG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).
The packaging for this particular electronic component is a tray, which is used to securely hold and transport the product. It follows the JESD-609 code of e0, indicating that it meets the industry standard for moisture sensitivity level. The part status is currently active, meaning it is currently in production and available for purchase. The HTS code for this product is 8542.39.00.01, which is used for classification and tariff purposes. The technology used in this component is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a commonly used technology in the semiconductor industry. The terminal position is at the bottom, and the terminal form is in the shape of a ball. It follows the JESD-30 code of S-PBGA-B676, which stands for Small Plastic Ball Grid Array with 676 balls. The core processor for this component is the ARM® Cortex®-M3, which is a widely used 32-bit processor. In addition, this component boasts an impressive 56520 logic cells, making it a powerful and efficient choice for various applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S060TS-1FG676I System On Chip (SoC) applications.

Level
Remote control
Sports
Temperature
Flow Sensors
Functional safety for critical applications in the industrial sectors
PC peripherals
Healthcare
Medical Pressure
Wireless sensor networks