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M2S060TS-1FG676

Microsemi Corporation M2S060TS-1FG676

Part Number:
M2S060TS-1FG676
Manufacturer:
Microsemi Corporation
Ventron No:
4544173-M2S060TS-1FG676
Description:
IC FPGA SOC 60K LUTS
ECAD Model:
Datasheet:
M2S060TS-1FG676

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Specifications
Microsemi Corporation M2S060TS-1FG676 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060TS-1FG676.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    676-BGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B676
  • Number of Outputs
    387
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    387
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    387
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 60K Logic Modules
  • Number of Logic Cells
    56520
  • Flash Size
    256KB
  • Height Seated (Max)
    2.44mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The JESD-609 Code for this product is e0, with a total of 676 terminations. It utilizes CMOS technology and has a terminal position of BOTTOM. The JESD-30 Code for this product is S-PBGA-B676. The minimum supply voltage (Vsup) required for this product is 1.14V. It is powered by an ARM® Cortex®-M3 core processor and includes peripherals such as DDR, PCIe, and SERDES. This product has 387 inputs and a total of 56520 logic cells.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S060TS-1FG676 System On Chip (SoC) applications.

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M2S060TS-1FG676 More Descriptions
M2S060Ts-1Fg676 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060TS-1FG676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
Product Comparison
The three parts on the right have similar specifications to M2S060TS-1FG676.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Pbfree Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S060TS-1FG676
    M2S060TS-1FG676
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    676
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    387
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S005-1TQ144I
    M2S005-1TQ144I
    Microsemi Corporation
    -
    OBSOLETE (Last Updated: 3 weeks ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Obsolete
    3 (168 Hours)
    144
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    not_compliant
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 5K Logic Modules
    -
    128KB
    1.6mm
    20mm
    20mm
    Non-RoHS Compliant
    no
    -
    -
    -
    -
    -
    -
    -
    M2S060TS-1FG676 vs M2S005-1TQ144I
  • M2S090S-1FGG484I
    M2S090S-1FGG484I
    Microsemi Corporation
    -
    -
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 90K Logic Modules
    -
    512KB
    -
    -
    -
    RoHS Compliant
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S090S
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    M2S060TS-1FG676 vs M2S090S-1FGG484I
  • M2S025-1FG484
    M2S025-1FG484
    Microsemi Corporation
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    -
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    M2S060TS-1FG676 vs M2S025-1FG484
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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