M2S060T-1FG484M

Microsemi Corporation M2S060T-1FG484M

Part Number:
M2S060T-1FG484M
Manufacturer:
Microsemi Corporation
Ventron No:
4544180-M2S060T-1FG484M
Description:
IC FPGA SOC
ECAD Model:
Datasheet:
M2GL0xx Product Brief

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Specifications
Microsemi Corporation M2S060T-1FG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060T-1FG484M.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    484-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -55°C~125°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    3A001.A.2.C
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B484
  • Supply Voltage-Max (Vsup)
    1.26V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    267
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 60K Logic Modules
  • Flash Size
    256KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.Temperatures should be -55°C~125°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 267 I/Os.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which is great for system on a chip.The flash is set to 256KB.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S060T-1FG484M System On Chip (SoC) applications.

Vending machines
Robotics
Personal Computers
Healthcare
AC drive control module
Industrial automation devices
System-on-chip (SoC)
Transmitters
Central alarm system
DC-input BLDC motor drive
M2S060T-1FG484M More Descriptions
M2S060T-1Fg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060T-1FG484M
FPGA SmartFusion2 Family 56520 Cells 65nm Technology 1.2V 484-Pin FBGA
ARM® Cortex®-M3 SOC IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S060T-1FG484M.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Programmable Logic Type
    Primary Attributes
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Subcategory
    Technology
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of Inputs
    Number of Logic Cells
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S060T-1FG484M
    M2S060T-1FG484M
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    YES
    -55°C~125°C TJ
    Tray
    SmartFusion®2
    e0
    yes
    Active
    3 (168 Hours)
    484
    3A001.A.2.C
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B484
    1.26V
    1.14V
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 60K Logic Modules
    256KB
    2.44mm
    23mm
    23mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S050TS-FG896
    4 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e0
    -
    Active
    3 (168 Hours)
    896
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B896
    1.26V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    256KB
    2.44mm
    31mm
    31mm
    Non-RoHS Compliant
    2015
    Field Programmable Gate Arrays
    CMOS
    377
    Not Qualified
    1.2V
    377
    56340
    -
    -
    -
    -
    -
    -
    -
  • M2S005-1TQ144I
    -
    OBSOLETE (Last Updated: 3 weeks ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e0
    no
    Obsolete
    3 (168 Hours)
    144
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    not_compliant
    NOT SPECIFIED
    S-PQFP-G144
    1.26V
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 5K Logic Modules
    128KB
    1.6mm
    20mm
    20mm
    Non-RoHS Compliant
    2015
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    SmartFusion®2
    -
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FPGA - 25K Logic Modules
    256KB
    -
    -
    -
    Non-RoHS Compliant
    2009
    -
    -
    -
    -
    -
    -
    -
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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