Microsemi Corporation M2S060T-1FG484M
- Part Number:
- M2S060T-1FG484M
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544180-M2S060T-1FG484M
- Description:
- IC FPGA SOC
- Datasheet:
- M2GL0xx Product Brief
Microsemi Corporation M2S060T-1FG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060T-1FG484M.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature-55°C~125°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee0
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- ECCN Code3A001.A.2.C
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.39.00.01
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B484
- Supply Voltage-Max (Vsup)1.26V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O267
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 60K Logic Modules
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.Temperatures should be -55°C~125°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 267 I/Os.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which is great for system on a chip.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FG484M System On Chip (SoC) applications.
Vending machines
Robotics
Personal Computers
Healthcare
AC drive control module
Industrial automation devices
System-on-chip (SoC)
Transmitters
Central alarm system
DC-input BLDC motor drive
This SoC is built on ARM? Cortex?-M3 core processor(s).Package 484-BGA is assigned to this system on a chip by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.Internally, this SoC design uses the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.Temperatures should be -55°C~125°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 267 I/Os.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 484 terminations, which is great for system on a chip.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FG484M System On Chip (SoC) applications.
Vending machines
Robotics
Personal Computers
Healthcare
AC drive control module
Industrial automation devices
System-on-chip (SoC)
Transmitters
Central alarm system
DC-input BLDC motor drive
M2S060T-1FG484M More Descriptions
M2S060T-1Fg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060T-1FG484M
FPGA SmartFusion2 Family 56520 Cells 65nm Technology 1.2V 484-Pin FBGA
ARM® Cortex®-M3 SOC IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
FPGA SmartFusion2 Family 56520 Cells 65nm Technology 1.2V 484-Pin FBGA
ARM® Cortex®-M3 SOC IC SmartFusion®2 FPGA - 60K Logic Modules 256KB 64KB 166MHz
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S060T-1FG484M.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureProgrammable Logic TypePrimary AttributesFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPublishedSubcategoryTechnologyNumber of OutputsQualification StatusPower SuppliesNumber of InputsNumber of Logic CellsSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S060T-1FG484M10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGAYES-55°C~125°C TJTraySmartFusion®2e0yesActive3 (168 Hours)4843A001.A.2.CTin/Lead (Sn/Pb)8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliantNOT SPECIFIEDS-PBGA-B4841.26V1.14V267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules256KB2.44mm23mm23mmRoHS Compliant----------------
-
4 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES0°C~85°C TJTraySmartFusion®2e0-Active3 (168 Hours)896-Tin/Lead (Sn/Pb)8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliantNOT SPECIFIEDS-PBGA-B8961.26V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules256KB2.44mm31mm31mmNon-RoHS Compliant2015Field Programmable Gate ArraysCMOS377Not Qualified1.2V37756340-------
-
-OBSOLETE (Last Updated: 3 weeks ago)144-LQFPYES-40°C~100°C TJTraySmartFusion®2e0noObsolete3 (168 Hours)144-Tin/Lead (Sn/Pb)8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mmnot_compliantNOT SPECIFIEDS-PQFP-G1441.26V1.14V84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFIELD PROGRAMMABLE GATE ARRAYFPGA - 5K Logic Modules128KB1.6mm20mm20mmNon-RoHS Compliant2015--------------
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTraySmartFusion®2--Active3 (168 Hours)--------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 25K Logic Modules256KB---Non-RoHS Compliant2009-------484-FPBGA (23x23)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
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