Microsemi Corporation M2S050TS-1FGG896I
- Part Number:
- M2S050TS-1FGG896I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669264-M2S050TS-1FGG896I
- Description:
- IC FPGA SOC 50K LUTS 896FBGA
Microsemi Corporation M2S050TS-1FGG896I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050TS-1FGG896I.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case896-BGA
- Supplier Device Package896-FBGA (31x31)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Frequency166MHz
- Base Part NumberM2S050TS
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O377
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Core ArchitectureARM
- Primary AttributesFPGA - 50K Logic Modules
- Flash Size256KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The SmartFusion®2 Series is a powerful and versatile family of devices that combines the capabilities of an MCU and an FPGA in a single chip. One of the key features of this series is its Moisture Sensitivity Level (MSL) of 3, which means it can withstand a maximum exposure of 168 hours to moisture before it needs to be resealed. The specific model mentioned, M2S050TS, has a RAM size of 64KB and is powered by an ARM® Cortex®-M3 core processor. It also offers a wide range of peripherals such as DDR, PCIe, and SERDES, making it suitable for a variety of applications. The connectivity options of this device are also impressive, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. Its architecture, which combines both MCU and FPGA, allows for flexibility and customization. The core architecture is based on the popular ARM design, and it also has a flash size of 256KB, providing ample space for code and data storage. Overall, the SmartFusion®2 Series offers a comprehensive and efficient solution for a wide range of embedded system designs.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S050TS-1FGG896I System On Chip (SoC) applications.
Fitness
Smart appliances
Efficient hardware for training of neural networks
Microprocessors
sequence controllers
USB hard disk enclosure
Flow Sensors
Vending machines
Print Special Issue Flyer
Medical Pressure
The SmartFusion®2 Series is a powerful and versatile family of devices that combines the capabilities of an MCU and an FPGA in a single chip. One of the key features of this series is its Moisture Sensitivity Level (MSL) of 3, which means it can withstand a maximum exposure of 168 hours to moisture before it needs to be resealed. The specific model mentioned, M2S050TS, has a RAM size of 64KB and is powered by an ARM® Cortex®-M3 core processor. It also offers a wide range of peripherals such as DDR, PCIe, and SERDES, making it suitable for a variety of applications. The connectivity options of this device are also impressive, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. Its architecture, which combines both MCU and FPGA, allows for flexibility and customization. The core architecture is based on the popular ARM design, and it also has a flash size of 256KB, providing ample space for code and data storage. Overall, the SmartFusion®2 Series offers a comprehensive and efficient solution for a wide range of embedded system designs.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S050TS-1FGG896I System On Chip (SoC) applications.
Fitness
Smart appliances
Efficient hardware for training of neural networks
Microprocessors
sequence controllers
USB hard disk enclosure
Flow Sensors
Vending machines
Print Special Issue Flyer
Medical Pressure
M2S050TS-1FGG896I More Descriptions
M2S050Ts-1Fgg896I 896 Pbga 31X31X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050TS-1FGG896I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 896FBGA
The three parts on the right have similar specifications to M2S050TS-1FGG896I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSupplier Device PackageOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureCore ArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountPublishedJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable Logic TypeHeight Seated (Max)LengthWidthSubcategoryTechnologyNumber of OutputsQualification StatusPower SuppliesNumber of InputsNumber of Logic CellsView Compare
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M2S050TS-1FGG896I8 WeeksIN PRODUCTION (Last Updated: 1 month ago)896-BGA896-FBGA (31x31)-40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S050TSCAN, Ethernet, I2C, SPI, UART, USART, USB377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 50K Logic Modules256KBRoHS Compliant----------------------------
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFP--40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)-----84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 10K Logic Modules256KBRoHS CompliantYES2015e3yes144MATTE TIN8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G1441.26V1.14VFIELD PROGRAMMABLE GATE ARRAY1.6mm20mm20mm-------
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8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGA--40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)-----377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FPGA - 50K Logic Modules256KBRoHS CompliantYES-e3-896MATTE TIN8542.39.00.01BOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B8961.26V1.14VFIELD PROGRAMMABLE GATE ARRAY2.44mm31mm31mmField Programmable Gate ArraysCMOS377Not Qualified1.2V37756340
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)-40°C~100°C TJTraySmartFusion®2Active3 (168 Hours)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USB267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAARMFPGA - 25K Logic Modules256KBRoHS Compliant-2009-------------------------
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