Microsemi Corporation M2S050T-FGG484I
- Part Number:
- M2S050T-FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668453-M2S050T-FGG484I
- Description:
- IC FPGA SOC 50K LUT 484FBGA
- Datasheet:
- M2S050T-FGG484I
Microsemi Corporation M2S050T-FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050T-FGG484I.
- Factory Lead Time11 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2014
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B484
- Number of Outputs267
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O267
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs267
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 50K Logic Modules
- Number of Logic Cells56340
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 267 I/Os.It is advised to utilize a 1.2V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.A system on a chip benefits from having 484 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.The SoC chip that comes with this module can be configured to have 267 outputs.A power supply of 1.2V is required.The SoC chip is equipped with 267 inputs.System on chips of logic are comprised of 56340 logic cells.It has a 256KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050T-FGG484I System On Chip (SoC) applications.
Published Paper
Networked Media Encode/Decode
Special Issue Information
Deep learning hardware
Central alarm system
Three phase UPS
Digital Signal Processing
Flow Sensors
Automated sorting equipment
Level
On this SoC, there is ARM? Cortex?-M3 core processor.Package 484-BGA is assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 267 I/Os.It is advised to utilize a 1.2V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.A system on a chip benefits from having 484 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.The SoC chip that comes with this module can be configured to have 267 outputs.A power supply of 1.2V is required.The SoC chip is equipped with 267 inputs.System on chips of logic are comprised of 56340 logic cells.It has a 256KB flash.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050T-FGG484I System On Chip (SoC) applications.
Published Paper
Networked Media Encode/Decode
Special Issue Information
Deep learning hardware
Central alarm system
Three phase UPS
Digital Signal Processing
Flow Sensors
Automated sorting equipment
Level
M2S050T-FGG484I More Descriptions
M2S050T-Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S050T-FGG484I
FPGA SmartFusion2 Family 56340 Cells 65nm Technology 1.2V 484-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
SMARTFUSION2 50K LUT SOC FPGA WITH HIGH SPEED TRANSCEIVERS
IC SOC CORTEX-M3 166MHZ 484FBGA
FPGA SmartFusion2 Family 56340 Cells 65nm Technology 1.2V 484-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
SMARTFUSION2 50K LUT SOC FPGA WITH HIGH SPEED TRANSCEIVERS
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S050T-FGG484I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S050T-FGG484I11 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGAYES-40°C~100°C TJTray2014SmartFusion®2e3Active3 (168 Hours)484MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B484267Not Qualified1.26V1.2V1.14V267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA267FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm23mm23mmRoHS Compliant--------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)144-LQFPYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSQUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G14484Not Qualified1.26V1.2V1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA84FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliant-------
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant-------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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