Microsemi Corporation M2S050-FCSG325
- Part Number:
- M2S050-FCSG325
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828039-M2S050-FCSG325
- Description:
- IC FPGA SOC 50K LUTS
- Datasheet:
- M2S050-FCSG325
Microsemi Corporation M2S050-FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050-FCSG325.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case325-TFBGA, CSPBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations325
- Terminal FinishMATTE TIN
- Additional FeatureLG-MIN, WD-MIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.5mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B325
- Number of Outputs200
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O200
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs200
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 50K Logic Modules
- Number of Logic Cells56340
- Flash Size256KB
- Height Seated (Max)1.01mm
- Length11mm
- Width11mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the SmartFusion?2 series.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 200 I/Os.A 1.2V power supply is recommended.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supply should be at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 325 terminations in total.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 200 inputs is available.The logic SoC features 56340 logic cells.It has a 256KB flash.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-FCSG325 System On Chip (SoC) applications.
Functional safety for critical applications in the aerospace
ARM processors
System-on-chip (SoC)
sequence controllers
Central alarm system
Central inverter
Mouse
Industrial AC-DC
Automotive gateway
AC-input BLDC motor drive
A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the SmartFusion?2 series.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 200 I/Os.A 1.2V power supply is recommended.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supply should be at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 325 terminations in total.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 200 inputs is available.The logic SoC features 56340 logic cells.It has a 256KB flash.This SoC processor also includes LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-FCSG325 System On Chip (SoC) applications.
Functional safety for critical applications in the aerospace
ARM processors
System-on-chip (SoC)
sequence controllers
Central alarm system
Central inverter
Mouse
Industrial AC-DC
Automotive gateway
AC-input BLDC motor drive
M2S050-FCSG325 More Descriptions
M2S050-Fcsg325 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2S050-FCSG325
FPGA SmartFusion2 56340 Cells 65nm Technology 1.2V 325-Pin FCBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
FPGA SmartFusion2 56340 Cells 65nm Technology 1.2V 325-Pin FCBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
The three parts on the right have similar specifications to M2S050-FCSG325.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPbfree CodeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S050-FCSG32510 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)325-TFBGA, CSPBGAYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)325MATTE TINLG-MIN, WD-MIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PBGA-B325200Not Qualified1.26V1.2V1.14V200166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA200FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB1.01mm11mm11mmRoHS Compliant---------
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN-8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliantyes-------
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN-8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant--------
-
--484-BGA--40°C~100°C TJTray-SmartFusion®2-Obsolete3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant-484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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