M2S050-FCSG325

Microsemi Corporation M2S050-FCSG325

Part Number:
M2S050-FCSG325
Manufacturer:
Microsemi Corporation
Ventron No:
3828039-M2S050-FCSG325
Description:
IC FPGA SOC 50K LUTS
ECAD Model:
Datasheet:
M2S050-FCSG325

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Specifications
Microsemi Corporation M2S050-FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050-FCSG325.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 2 weeks ago)
  • Package / Case
    325-TFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    325
  • Terminal Finish
    MATTE TIN
  • Additional Feature
    LG-MIN, WD-MIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B325
  • Number of Outputs
    200
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    200
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    200
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 50K Logic Modules
  • Number of Logic Cells
    56340
  • Flash Size
    256KB
  • Height Seated (Max)
    1.01mm
  • Length
    11mm
  • Width
    11mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.It is a member of the SmartFusion?2 series.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.This SoC security combines FPGA - 50K Logic Modules, an important feature to keep in mind.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 200 I/Os.A 1.2V power supply is recommended.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supply should be at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 325 terminations in total.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 200 outputs.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 200 inputs is available.The logic SoC features 56340 logic cells.It has a 256KB flash.This SoC processor also includes LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S050-FCSG325 System On Chip (SoC) applications.

Functional safety for critical applications in the aerospace
ARM processors
System-on-chip (SoC)
sequence controllers
Central alarm system
Central inverter
Mouse
Industrial AC-DC
Automotive gateway
AC-input BLDC motor drive
M2S050-FCSG325 More Descriptions
M2S050-Fcsg325 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2S050-FCSG325
FPGA SmartFusion2 56340 Cells 65nm Technology 1.2V 325-Pin FCBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
Product Comparison
The three parts on the right have similar specifications to M2S050-FCSG325.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Pbfree Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S050-FCSG325
    M2S050-FCSG325
    10 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    325-TFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    325
    MATTE TIN
    LG-MIN, WD-MIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PBGA-B325
    200
    Not Qualified
    1.26V
    1.2V
    1.14V
    200
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    200
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    1.01mm
    11mm
    11mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S010-TQG144I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 days ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    MATTE TIN
    -
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    yes
    -
    -
    -
    -
    -
    -
    -
  • M2S050T-FGG896I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S090S-1FGG484I
    -
    -
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 90K Logic Modules
    -
    512KB
    -
    -
    -
    RoHS Compliant
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S090S
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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