Microsemi Corporation M2S025T-VF256I
- Part Number:
- M2S025T-VF256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828041-M2S025T-VF256I
- Description:
- IC FPGA SOC 25K LUTS
- Datasheet:
- M2S025T-VF256I
Microsemi Corporation M2S025T-VF256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025T-VF256I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case256-LFBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Lead (Sn/Pb)
- Additional FeatureLG-MIN, WD-MIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B256
- Number of Outputs138
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O138
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs138
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 25K Logic Modules
- Number of Logic Cells27696
- Flash Size256KB
- Height Seated (Max)1.56mm
- Length14mm
- Width14mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
This component is manufactured by Microsemi Corporation and is classified as an Embedded - System On Chip (SoC) chip, falling under the Embedded - System On Chip (SoC) category. It has an operating temperature range of -40°C to 100°C TJ and is packaged in a tray. The specific series of this chip is SmartFusion®2 and its terminal finish is made of Tin/Lead (Sn/Pb). The minimum supply voltage required for this chip is 1.14V and it has a speed of 166MHz. It has a total of 138 inputs and 27696 logic cells. The flash size of this chip is 256KB and it measures 14mm in length.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-VF256I System On Chip (SoC) applications.
Embedded systems
Mobile market
Microcontroller based SoC ( RISC-V, ARM)
Special Issue Information
Medical Pressure
Wireless networking
Sensor network-on-chip (sNoC)
Industrial
Industrial robot
Communication interfaces ( I2C, SPI )
This component is manufactured by Microsemi Corporation and is classified as an Embedded - System On Chip (SoC) chip, falling under the Embedded - System On Chip (SoC) category. It has an operating temperature range of -40°C to 100°C TJ and is packaged in a tray. The specific series of this chip is SmartFusion®2 and its terminal finish is made of Tin/Lead (Sn/Pb). The minimum supply voltage required for this chip is 1.14V and it has a speed of 166MHz. It has a total of 138 inputs and 27696 logic cells. The flash size of this chip is 256KB and it measures 14mm in length.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025T-VF256I System On Chip (SoC) applications.
Embedded systems
Mobile market
Microcontroller based SoC ( RISC-V, ARM)
Special Issue Information
Medical Pressure
Wireless networking
Sensor network-on-chip (sNoC)
Industrial
Industrial robot
Communication interfaces ( I2C, SPI )
M2S025T-VF256I More Descriptions
M2S025T-Vf256I 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S025T-VF256I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
The three parts on the right have similar specifications to M2S025T-VF256I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S025T-VF256I10 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)256-LFBGAYES-40°C~100°C TJTray2015SmartFusion®2e0Active3 (168 Hours)256Tin/Lead (Sn/Pb)LG-MIN, WD-MIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.8mmnot_compliantNOT SPECIFIEDS-PBGA-B256138Not Qualified1.26V1.2V1.14V138166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA138FIELD PROGRAMMABLE GATE ARRAYFPGA - 25K Logic Modules27696256KB1.56mm14mm14mmNon-RoHS Compliant--------
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--484-BGA--40°C~100°C TJTray-SmartFusion®2-Obsolete3 (168 Hours)-------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTray2009SmartFusion®2-Active3 (168 Hours)-------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---Non-RoHS Compliant484-FPBGA (23x23)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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