M2S025-1VF256I

Microsemi Corporation M2S025-1VF256I

Part Number:
M2S025-1VF256I
Manufacturer:
Microsemi Corporation
Ventron No:
3162570-M2S025-1VF256I
Description:
IC FPGA SOC 25K LUTS
ECAD Model:
Datasheet:
M2S025-1VF256I

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Specifications
Microsemi Corporation M2S025-1VF256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025-1VF256I.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    256-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Additional Feature
    LG-MIN, WD-MIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B256
  • Number of Outputs
    138
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    138
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    138
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 25K Logic Modules
  • Number of Logic Cells
    27696
  • Flash Size
    256KB
  • Height Seated (Max)
    1.56mm
  • Length
    14mm
  • Width
    14mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation offers a highly advanced Embedded - System On Chip (SoC) chip, designed to meet the demands of the rapidly evolving technology landscape. This particular chip falls under the category of Embedded - System On Chip (SoC) and boasts an impressive number of 256 terminations. The terminal position is located at the bottom, with a supply voltage of 1.2V. Although this chip is not yet qualified, it has a maximum supply voltage of 1.26V and features essential peripherals such as DDR, PCIe, and SERDES. Additionally, it utilizes a FIELD PROGRAMMABLE GATE ARRAY as its programmable logic type, providing flexibility and adaptability. With its primary attribute being FPGA - 25K Logic Modules, this chip also offers a flash size of 256KB and a maximum seated height of 1.56mm.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S025-1VF256I System On Chip (SoC) applications.

Sports
Industrial Pressure
Temperature Sensors
Medical
Functional safety for critical applications in the aerospace
Sensor network-on-chip (sNoC)
Microprocessors
Efficient hardware for inference of neural networks
Level
Personal Computers
M2S025-1VF256I More Descriptions
M2S025-1Vf256I 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S025-1VF256I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S025-1VF256I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lifecycle Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S025-1VF256I
    M2S025-1VF256I
    10 Weeks
    256-LFBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    256
    Tin/Lead (Sn/Pb)
    LG-MIN, WD-MIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.8mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B256
    138
    Not Qualified
    1.26V
    1.2V
    1.14V
    138
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    138
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 25K Logic Modules
    27696
    256KB
    1.56mm
    14mm
    14mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S050T-FGG896I
    8 Weeks
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    IN PRODUCTION (Last Updated: 2 weeks ago)
    -
    -
    -
    -
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    IN PRODUCTION (Last Updated: 1 month ago)
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025T-1FGG484I
    10 Weeks
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    IN PRODUCTION (Last Updated: 1 month ago)
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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