Part Number: XC7Z100-1FF900I vs XC7Z035-1FFG900I

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Part Number: XC7Z100-1FF900I XC7Z035-1FFG900I
Manufacturer: Xilinx Inc. Xilinx Inc.
Description: IC SOC CORTEX-A9 KINTEX7 900BGA IC SOC CORTEX-A9 KINTEX7 900BGA
Quantity Available: Available Available
Datasheets: - -
Factory Lead Time 10 Weeks 10 Weeks
Package / Case 900-BBGA, FCBGA 900-BBGA, FCBGA
Supplier Device Package 900-FCBGA (31x31) -
Operating Temperature -40°C~100°C TJ -40°C~100°C TJ
Packaging Tray Tray
Published 2010 2010
Series Zynq®-7000 Zynq®-7000
Part Status Active Active
Moisture Sensitivity Level (MSL) 4 (72 Hours) 4 (72 Hours)
Max Operating Temperature 100°C -
Min Operating Temperature -40°C -
Frequency 667MHz 667MHz
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130 130
Speed 667MHz -
RAM Size 256KB 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA MCU, FPGA
Data Bus Width 32b -
Core Architecture ARM ARM
Max Frequency 667MHz -
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells Kintex™-7 FPGA, 275K Logic Cells
RoHS Status Non-RoHS Compliant ROHS3 Compliant
Surface Mount - YES
Number of Pins - 900
JESD-609 Code - e1
Number of Terminations - 900
Terminal Finish - Tin/Silver/Copper (Sn/Ag/Cu)
Technology - CMOS
Terminal Position - BOTTOM
Terminal Form - BALL
Peak Reflow Temperature (Cel) - 245
Supply Voltage - 1V
Reflow Temperature-Max (s) - 30
Operating Supply Voltage - 1V
Propagation Delay - 130 ps
Boundary Scan - YES
Speed Grade - 1
RAM (words) - 256000
Number of Registers - 343800
Bus Compatibility - CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) - 3.35mm
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