Xilinx Inc. XC7Z100-1FF900I

Name: XC7Z100-1FF900I
Brand: Xilinx Inc.
SKU: 3162953-XC7Z100-1FF900I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7Z100-1FF900I

Manufacturer:: Xilinx Inc.

Ventron No:: 3162953-XC7Z100-1FF900I

Description:: IC SOC CORTEX-A9 KINTEX7 900BGA

ECAD Model:

Datasheet:: XC7Z100-1FF900I

Specifications

Xilinx Inc. XC7Z100-1FF900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7Z100-1FF900I.

Factory Lead Time
10 Weeks
Package / Case
900-BBGA, FCBGA
Supplier Device Package
900-FCBGA (31x31)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2010
Series
Zynq®-7000
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Frequency
667MHz
Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O
130
Speed
667MHz
RAM Size
256KB
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Data Bus Width
32b
Core Architecture
ARM
Max Frequency
667MHz
Primary Attributes
Kintex™-7 FPGA, 444K Logic Cells
RoHS Status
Non-RoHS Compliant

Description

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The Supplier Device Package for the Zynq®-7000 series is a 900-FCBGA (31x31) package that was published in 2010. It has a maximum operating temperature of 100°C and a frequency of 667MHz. This device also features a speed of 667MHz, making it a high-performing option for various applications. Along with its impressive frequency and speed, it also includes peripherals such as DMA, making it a versatile choice for different tasks. Its architecture consists of both an MCU and FPGA, providing a powerful combination for processing and programmability. The core architecture of this device is ARM, further enhancing its capabilities. With a maximum frequency of 667MHz, this Supplier Device Package offers a reliable and efficient solution for a range of needs.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.
XC7Z100-1FF900I System On Chip (SoC) applications.

Central inverter
ARM Cortex M4 microcontroller
RISC-V
Robotics
Keyboard
Networked Media Encode/Decode
Smart appliances
AC drive control module
Sports
Wireless networking

XC7Z100-1FF900I More Descriptions

MPU Zynq-7000 RISC 32-Bit 667MHz 1.5V/2V/2.5V 900-Pin F-BGA
IC SOC CORTEX-A9 667MHZ 900FCBGA
SubSMA Diodes - Rectifiers - Hyperfast RoHS
Processors - Application Specialized

Product Comparison

The three parts on the right have similar specifications to XC7Z100-1FF900I.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Data Bus Width

Core Architecture

Max Frequency

Primary Attributes

RoHS Status

Contact Plating

Mount

JESD-609 Code

Number of Terminations

Terminal Finish

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

JESD-30 Code

Max Supply Voltage

Min Supply Voltage

Propagation Delay

Boundary Scan

Speed Grade

RAM (words)

Number of Registers

Bus Compatibility

Height Seated (Max)

Length

Width

Surface Mount

Number of Pins

Operating Supply Voltage

View Compare
XC7Z100-1FF900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

900-FCBGA (31x31)

-40°C~100°C TJ

Tray

2010

Zynq®-7000

Active

4 (72 Hours)

100°C

-40°C

667MHz

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

667MHz

Kintex™-7 FPGA, 444K Logic Cells

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7Z045-3FFV676E

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~100°C TJ

Bulk

2009

Zynq®-7000

Active

4 (72 Hours)

-

-

-

-

130

1GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

-

-

Kintex™-7 FPGA, 350K Logic Cells

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

XC7Z100-1FF900I vs XC7Z045-3FFV676E
XC7Z035-1FBG676C

Xilinx Inc.

10 Weeks

676-BBGA, FCBGA

-

0°C~85°C TJ

Tray

2010

Zynq®-7000

Active

3 (168 Hours)

-

-

667MHz

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

-

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

ARM

-

Kintex™-7 FPGA, 275K Logic Cells

ROHS3 Compliant

Copper, Silver, Tin

Surface Mount

e1

676

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

NOT SPECIFIED

S-PBGA-B676

1.05V

950mV

120 ps

YES

1

256000

343800

CAN; ETHERNET; I2C; SPI; UART; USB

2.54mm

27mm

27mm

-

-

-

XC7Z100-1FF900I vs XC7Z035-1FBG676C
XC7Z035-1FFG900I

Xilinx Inc.

10 Weeks

900-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

2010

Zynq®-7000

Active

4 (72 Hours)

-

-

667MHz

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

130

-

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

-

ARM

-

Kintex™-7 FPGA, 275K Logic Cells

ROHS3 Compliant

-

-

e1

900

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

245

1V

30

-

-

-

130 ps

YES

1

256000

343800

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

-

-

YES

900

1V

XC7Z100-1FF900I vs XC7Z035-1FFG900I