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MK53DX256ZCLQ10

NXP USA Inc. MK53DX256ZCLQ10

Part Number:
MK53DX256ZCLQ10
Manufacturer:
NXP USA Inc.
Ventron No:
8564267-MK53DX256ZCLQ10
Description:
256KB 256K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K50 Series MK53DX256 3.3V 144-LQFP
ECAD Model:
Datasheet:
MK53DX256ZCLQ10

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Specifications
NXP USA Inc. MK53DX256ZCLQ10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK53DX256ZCLQ10.
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    Kinetis K50
  • Published
    2012
  • JESD-609 Code
    e3
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Base Part Number
    MK53DX256
  • JESD-30 Code
    S-PQFP-G144
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    94
  • Speed
    100MHz
  • RAM Size
    128K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Clock Frequency
    32MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    256KB 256K x 8
  • Connectivity
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Bit Size
    32
  • Data Converter
    A/D 41x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • EEPROM Size
    4K x 8
  • Length
    20mm
  • Height Seated (Max)
    1.6mm
  • Width
    20mm
  • RoHS Status
    ROHS3 Compliant
Description
MK53DX256ZCLQ10 Overview
This Microcontroller comes in a 144-LQFP package. This Microcontroller has 94 I/Os. The Mounting Type of the Microcontroller is Surface Mount. The MCU is based on the 32-Bit core. This Microcontroller's program memory type is FLASH. The Microcontroller runs in -40°C~85°C TA Operating Temperature. Microcontroller runs in Kinetis K50 Series. The size of the program memory of Microcontroller is 256KB 256K x 8. MCU is powered by ARM® Cortex®-M4 Core Processor. The device belongs to MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs Type. The MCU has a number of 144 terminals. Microcontroller comes with 32 bit size. The component always operates in 3.3V supply voltage. MCU chip has YES DMA channels. You can find alternatives through the base part number MK53DX256. The device works in YES PWM channels. It is at 32MHz clock frequency.

MK53DX256ZCLQ10 Features
144-LQFP package
Mounting type of Surface Mount


MK53DX256ZCLQ10 Applications
There are a lot of NXP USA Inc.
MK53DX256ZCLQ10 Microcontroller applications.


Automatic control
Equipment control
Instrument control
Toys
Robots
Radio
Television
Heater/Fan
Calculator
Kindle
MK53DX256ZCLQ10 More Descriptions
MCU 32-bit Kinetis K53 ARM Cortex M4 RISC 256KB Flash 1.8V/2.5V/3.3V 144-Pin LQFP Tray
Kinetis K53: 100MHz Cortex-M4 Measurement MCU, 512KB Flash, 64K RAM, USB, ETH, Segment LCD, 144-LQFP
ROHS3Compliant GULL WING QUAD CMOS Microcontroller -40C~85C TA 32MHz 1.6mm 128K x 8
IC 32BIT MCU KINETIS K50 100MHZ 144-LQFP; Controller Family/Series:(ARM Cortex - M4) Kinetis K50; Core Size:32bit; Digital IC Case Style:LQFP; No. of Pins:144; Program Memory Size:256 KB; RAM Memory Size:128KB; CPU Speed:100MHz ;RoHS Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to MK53DX256ZCLQ10.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    EEPROM Size
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Factory Lead Time
    Subcategory
    Reflow Temperature-Max (s)
    Power Supplies
    Supply Current-Max
    ROM (words)
    CPU Family
    View Compare
  • MK53DX256ZCLQ10
    MK53DX256ZCLQ10
    NXP USA Inc.
    Surface Mount
    144-LQFP
    YES
    -40°C~85°C TA
    Tray
    Kinetis K50
    2012
    e3
    Not For New Designs
    3 (168 Hours)
    144
    3A991.A.2
    MATTE TIN
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    40
    MK53DX256
    S-PQFP-G144
    Not Qualified
    3.6V
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    256KB 256K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    4K x 8
    20mm
    1.6mm
    20mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • MK53DN512ZCMD10
    MK53DN512ZCMD10
    NXP USA Inc.
    Surface Mount
    144-LBGA
    YES
    -40°C~85°C TA
    Tray
    Kinetis K50
    2013
    e1
    Not For New Designs
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.5mm
    40
    MK53DN512
    S-PBGA-B144
    Not Qualified
    3.6V
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    13mm
    1.7mm
    13mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    MK53DX256ZCLQ10 vs MK53DN512ZCMD10
  • MK53DN512CMD10
    MK53DN512CMD10
    NXP USA Inc.
    Surface Mount
    144-LBGA
    YES
    -40°C~85°C TA
    Tray
    Kinetis K50
    2012
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER OVER NICKEL
    8542.31.00.01
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    1mm
    -
    MK53DN512
    S-PBGA-B144
    Not Qualified
    3.6V
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    13mm
    -
    13mm
    ROHS3 Compliant
    13 Weeks
    Microcontrollers
    40
    1.8/3.3V
    79mA
    524288
    CORTEX-M4
    MK53DX256ZCLQ10 vs MK53DN512CMD10
  • MK53DN512ZCLQ10
    MK53DN512ZCLQ10
    NXP USA Inc.
    Surface Mount
    144-LQFP
    YES
    -40°C~85°C TA
    Tray
    Kinetis K50
    2012
    e3
    Not For New Designs
    3 (168 Hours)
    144
    3A991.A.2
    Matte Tin (Sn)
    8542.31.00.01
    CMOS
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    -
    MK53DN512
    S-PQFP-G144
    Not Qualified
    3.6V
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    20mm
    1.6mm
    20mm
    ROHS3 Compliant
    -
    -
    40
    -
    -
    -
    -
    MK53DX256ZCLQ10 vs MK53DN512ZCLQ10
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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