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MK53DN512CMD10

NXP USA Inc. MK53DN512CMD10

Part Number:
MK53DN512CMD10
Manufacturer:
NXP USA Inc.
Ventron No:
3138654-MK53DN512CMD10
Description:
IC MCU 32BIT 512KB FLASH 144BGA
ECAD Model:
Datasheet:
MK53DN512CMD10

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Specifications
NXP USA Inc. MK53DN512CMD10 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MK53DN512CMD10.
  • Factory Lead Time
    13 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2012
  • Series
    Kinetis K50
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN SILVER COPPER OVER NICKEL
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microcontrollers
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MK53DN512
  • JESD-30 Code
    S-PBGA-B144
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    1.8/3.3V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Oscillator Type
    Internal
  • Number of I/O
    94
  • Speed
    100MHz
  • RAM Size
    128K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.71V~3.6V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    ARM® Cortex®-M4
  • Peripherals
    DMA, I2S, LCD, LVD, POR, PWM, WDT
  • Clock Frequency
    50MHz
  • Program Memory Type
    FLASH
  • Core Size
    32-Bit
  • Program Memory Size
    512KB 512K x 8
  • Connectivity
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Supply Current-Max
    79mA
  • Bit Size
    32
  • Data Converter
    A/D 41x16b; D/A 2x12b
  • Has ADC
    YES
  • DMA Channels
    YES
  • PWM Channels
    YES
  • DAC Channels
    YES
  • ROM (words)
    524288
  • CPU Family
    CORTEX-M4
  • Length
    13mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
MK53DN512CMD10 Overview
Our product boasts a high number of terminations at 144, providing ample connectivity options for various applications. The power supplies offer a versatile range of 1.8/3.3V, catering to different voltage requirements. With a minimum supply voltage of 1.71V, our product ensures reliable and stable performance. The internal oscillator type and clock frequency of 50MHz further enhance the precision and accuracy of our product. With a maximum supply current of 79mA, our product is energy-efficient. The 32-bit size and A/D 41x16b; D/A 2x12b data converter make it suitable for complex data processing. Additionally, the product features PWM and DAC channels, providing flexibility in control and output.

MK53DN512CMD10 Features
144-LBGA package
Mounting type of Surface Mount
Microcontrollers subcategory

MK53DN512CMD10 Applications
There are a lot of NXP USA Inc. MK53DN512CMD10 Microcontroller applications.

Printers
Process control devices
Heater/Fan
3D printers
Industrial instrumentation devices
Routers
Video and voice processing
Graphic terminals
Calculators
DCS control intelligent sensor
MK53DN512CMD10 More Descriptions
MCU 32-bit K53 ARM Cortex M4 RISC 512KB Flash 1.8V/2.5V/3.3V 144-Pin MAPBGA Tray
RISC Microcontroller, 32-Bit, FLASH, CORTEX-M4 CPU, 100MHz, CMOS, PBGA144
Kinetis K53: 100MHz Cortex-M4 Measurement MCU, 512KB Flash, 128K RAM, USB, ETH, Segment LCD, 144-BGA
NXP MK53DN512CMD10 32 Bit Microcontroller, ARM Cortex-M4, 100 MHz, 512 KB, 128 KB, 144 Pins, MAPBGA
IC 32BIT MCU KINETIS K50 100MHZ 144-MAPBGA; Controller Family/Series:(ARM Cortex - M4) Kinetis K50; Core Size:32bit; No. of I/O's:94; Program Memory Size:512 KB; RAM Memory Size:128KB; CPU Speed:100MHz ;RoHS Compliant: Yes
MCU, 32BIT, KINETIS, 512K, 144MAP; Controller Family/Series:(ARM Cortex - M4) Kinetis K50; Core Size:32bit; No. of I/O's:94; Supply Voltage Min:1.71V; Supply Voltage Max:3.6V; Digital IC Case Style:MAPBGA; No. of Pins:144; Program Memory Size:512KB; RAM Memory Size:128KB; CPU Speed:100MHz; Peripherals:ADC, DAC, DMA, PWM, RTC, Timer; Embedded Interface Type:I2C, SCI, SPI, USB; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013); No. of Timers:2; Operating Temperature Range:-40°C to 85°C; Oscillator Type:External, Internal; Supply Voltage Range:1.71V to 3.6V
Product Comparison
The three parts on the right have similar specifications to MK53DN512CMD10.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Voltage - Supply (Vcc/Vdd)
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Clock Frequency
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Supply Current-Max
    Bit Size
    Data Converter
    Has ADC
    DMA Channels
    PWM Channels
    DAC Channels
    ROM (words)
    CPU Family
    Length
    Width
    RoHS Status
    EEPROM Size
    Time@Peak Reflow Temperature-Max (s)
    Height Seated (Max)
    View Compare
  • MK53DN512CMD10
    MK53DN512CMD10
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~85°C TA
    Tray
    2012
    Kinetis K50
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER OVER NICKEL
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    1mm
    40
    MK53DN512
    S-PBGA-B144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    79mA
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    524288
    CORTEX-M4
    13mm
    13mm
    ROHS3 Compliant
    -
    -
    -
    -
  • MK53DX256ZCMD10
    MK53DX256ZCMD10
    NXP USA Inc.
    -
    Surface Mount
    144-LBGA
    -
    -40°C~85°C TA
    Tray
    2012
    Kinetis K50
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    MK53DX256
    -
    -
    -
    -
    -
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    -
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    -
    FLASH
    32-Bit
    256KB 256K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    -
    A/D 41x16b; D/A 2x12b
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    4K x 8
    -
    -
    MK53DN512CMD10 vs MK53DX256ZCMD10
  • MK53DN512ZCMD10
    MK53DN512ZCMD10
    NXP USA Inc.
    -
    Surface Mount
    144-LBGA
    YES
    -40°C~85°C TA
    Tray
    2013
    Kinetis K50
    e1
    Not For New Designs
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    -
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    0.5mm
    -
    MK53DN512
    S-PBGA-B144
    Not Qualified
    3.6V
    -
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    32MHz
    FLASH
    32-Bit
    512KB 512K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    -
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    -
    -
    13mm
    13mm
    ROHS3 Compliant
    -
    40
    1.7mm
    MK53DN512CMD10 vs MK53DN512ZCMD10
  • MK53DX256CMD10
    MK53DX256CMD10
    NXP USA Inc.
    13 Weeks
    Surface Mount
    144-LBGA
    YES
    -40°C~85°C TA
    Tray
    2002
    Kinetis K50
    e1
    Active
    3 (168 Hours)
    144
    3A991.A.2
    TIN SILVER COPPER
    8542.31.00.01
    Microcontrollers
    CMOS
    BOTTOM
    BALL
    260
    3.3V
    1mm
    40
    MK53DX256
    S-PBGA-B144
    Not Qualified
    3.6V
    1.8/3.3V
    1.71V
    Internal
    94
    100MHz
    128K x 8
    1.71V~3.6V
    MICROCONTROLLER, RISC
    ARM® Cortex®-M4
    DMA, I2S, LCD, LVD, POR, PWM, WDT
    50MHz
    FLASH
    32-Bit
    256KB 256K x 8
    EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
    77mA
    32
    A/D 41x16b; D/A 2x12b
    YES
    YES
    YES
    YES
    262144
    CORTEX-M4
    13mm
    13mm
    ROHS3 Compliant
    4K x 8
    -
    -
    MK53DN512CMD10 vs MK53DX256CMD10
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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