ISSI, Integrated Silicon Solution Inc IS43TR82560C-15HBLI
- Part Number:
- IS43TR82560C-15HBLI
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 7374553-IS43TR82560C-15HBLI
- Description:
- Memory IC 10.5mm mm
- Datasheet:
- IS43TR82560C-15HBLI
ISSI, Integrated Silicon Solution Inc IS43TR82560C-15HBLI technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS43TR82560C-15HBLI.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case78-TFBGA
- Surface MountYES
- Operating Temperature-40°C~95°C TC
- PackagingTray
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations78
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeaturePROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
- TechnologySDRAM - DDR3
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage1.5V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)10
- JESD-30 CodeR-PBGA-B78
- Supply Voltage-Max (Vsup)1.575V
- Supply Voltage-Min (Vsup)1.425V
- Memory Size2Gb 256M x 8
- Number of Ports1
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency667MHz
- Access Time20ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization256MX8
- Memory Width8
- Write Cycle Time - Word, Page15ns
- Memory Density2147483648 bit
- Length10.5mm
- Height Seated (Max)1.2mm
- Width8mm
- RoHS StatusROHS3 Compliant
IS43TR82560C-15HBLI Overview
Its memory type can be classified as Volatile. It comes in a Tray. It is available in 78-TFBGA case. The memory size of the chip is 2Gb 256M x 8 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~95°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.425V~1.575V. Its recommended mounting type is Surface Mount. 78 terminations are planted on the chip. This part supports as many as 1 functions for the comprehensive working procedure. This ic memory chip is designed to be supplied with 1.5V. The memory has a clock frequency rotation within 667MHz. In spite of all the merits this chip has, it also features PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH to level up system performance. There are 1 ports used in this chip to give read and/or write access to one memory address.
IS43TR82560C-15HBLI Features
Package / Case: 78-TFBGA
Additional Feature:PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
IS43TR82560C-15HBLI Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43TR82560C-15HBLI Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
Its memory type can be classified as Volatile. It comes in a Tray. It is available in 78-TFBGA case. The memory size of the chip is 2Gb 256M x 8 Mb. This device utilizes a DRAM format memory which is of mainstream design. With an extended designed operating temperature of -40°C~95°C TC, this device is capable of lots of demanding applications. It is supplied votage within 1.425V~1.575V. Its recommended mounting type is Surface Mount. 78 terminations are planted on the chip. This part supports as many as 1 functions for the comprehensive working procedure. This ic memory chip is designed to be supplied with 1.5V. The memory has a clock frequency rotation within 667MHz. In spite of all the merits this chip has, it also features PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH to level up system performance. There are 1 ports used in this chip to give read and/or write access to one memory address.
IS43TR82560C-15HBLI Features
Package / Case: 78-TFBGA
Additional Feature:PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
IS43TR82560C-15HBLI Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43TR82560C-15HBLI Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
IS43TR82560C-15HBLI More Descriptions
EAR99 Surface Mount Tray 256MX8 ic memory 667MHz 20ns 8mm 2147483648bit
DRAM Chip DDR3 SDRAM 2Gbit 256Mx8 1.5V 78-Pin TW-BGA
DDR SDRAM, 256Mx8, 1.5V, 8K, BGA-78,RoHSISSI SCT
IC DRAM 2GBIT PARALLEL 78TWBGA
DRAM 2G 256Mx8 1333MT/s DDR3 1.5V
2G, 1.5V, Ddr3, 256Mx8, 1333Mt/S @ 9-9-9, 78 Ball Bga (8Mm X10.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43TR82560C-15HBLI
DRAM Chip DDR3 SDRAM 2Gbit 256Mx8 1.5V 78-Pin TW-BGA
DDR SDRAM, 256Mx8, 1.5V, 8K, BGA-78,RoHSISSI SCT
IC DRAM 2GBIT PARALLEL 78TWBGA
DRAM 2G 256Mx8 1333MT/s DDR3 1.5V
2G, 1.5V, Ddr3, 256Mx8, 1333Mt/S @ 9-9-9, 78 Ball Bga (8Mm X10.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43TR82560C-15HBLI
The three parts on the right have similar specifications to IS43TR82560C-15HBLI.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsMemory TypeOperating ModeClock FrequencyAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityLengthHeight Seated (Max)WidthRoHS StatusView Compare
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IS43TR82560C-15HBLI8 WeeksSurface Mount78-TFBGAYES-40°C~95°C TCTraye1Active3 (168 Hours)78EAR99Tin/Silver/Copper (Sn/Ag/Cu)PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESHSDRAM - DDR31.425V~1.575VBOTTOM26011.5V0.8mm10R-PBGA-B781.575V1.425V2Gb 256M x 81VolatileSYNCHRONOUS667MHz20nsDRAMParallel256MX8815ns2147483648 bit10.5mm1.2mm8mmROHS3 Compliant-
-
8 WeeksSurface Mount60-TFBGA--40°C~85°C TATape & Reel (TR)-Active3 (168 Hours)----SDRAM - DDR21.7V~1.9V---------2Gb 256M x 8-Volatile-333MHz450psDRAMParallel--15ns----ROHS3 Compliant
-
8 WeeksSurface Mount84-TFBGA--40°C~85°C TATape & Reel (TR)-Active3 (168 Hours)----SDRAM - DDR21.7V~1.9V---------2Gb 128M x 16-Volatile-400MHz400nsDRAMParallel--15ns----ROHS3 Compliant
-
8 WeeksSurface Mount60-TFBGAYES-40°C~85°C TATray-Active3 (168 Hours)60EAR99-PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESHSDRAM - DDR2.3V~2.7VBOTTOMNOT SPECIFIED12.5V1mmNOT SPECIFIEDR-PBGA-B602.7V2.3V512Mb 32M x 161VolatileSYNCHRONOUS200MHz700psDRAMParallel32MX161615ns536870912 bit13mm1.2mm8mmROHS3 Compliant
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