ISSI, Integrated Silicon Solution Inc IS43DR82560C-25DBLI-TR
- Part Number:
- IS43DR82560C-25DBLI-TR
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 7373091-IS43DR82560C-25DBLI-TR
- Description:
- Memory IC
- Datasheet:
- IS43DR82560C-25DBLI-TR
ISSI, Integrated Silicon Solution Inc IS43DR82560C-25DBLI-TR technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS43DR82560C-25DBLI-TR.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case60-TFBGA
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR2
- Voltage - Supply1.7V~1.9V
- Memory Size2Gb 256M x 8
- Memory TypeVolatile
- Clock Frequency400MHz
- Access Time400ps
- Memory FormatDRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page15ns
- RoHS StatusROHS3 Compliant
IS43DR82560C-25DBLI-TR Overview
As far as its memory type goes, it falls into the Volatile category. You can get memory ics in a Tape & Reel (TR) case. 60-TFBGA case encloses it. There is 2Gb 256M x 8 of memory on the chip. The device uses a mainstream DRAM-format memory. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. There is a voltage range of 1.7V~1.9V for the supply voltage. It is recommended that the mounting type be Surface Mount. It has a clock frequency of 400MHz.
IS43DR82560C-25DBLI-TR Features
Package / Case: 60-TFBGA
IS43DR82560C-25DBLI-TR Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43DR82560C-25DBLI-TR Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
As far as its memory type goes, it falls into the Volatile category. You can get memory ics in a Tape & Reel (TR) case. 60-TFBGA case encloses it. There is 2Gb 256M x 8 of memory on the chip. The device uses a mainstream DRAM-format memory. Suitable for use in a wide range of demanding applications, this device offers an extended operating temperature range of -40°C~85°C TA. There is a voltage range of 1.7V~1.9V for the supply voltage. It is recommended that the mounting type be Surface Mount. It has a clock frequency of 400MHz.
IS43DR82560C-25DBLI-TR Features
Package / Case: 60-TFBGA
IS43DR82560C-25DBLI-TR Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43DR82560C-25DBLI-TR Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
IS43DR82560C-25DBLI-TR More Descriptions
DRAM Chip DDR2 SDRAM 2G-Bit 256Mx8 1.8V 60-Pin TWBGA T/R
IC DRAM 2GBIT PARALLEL 60TWBGA
DRAM 2G 256Mx8 400MHz DDR2 1.8V
2G, 1.8V, Ddr2, 256Mx8, 400Mhz @ Cl5, 60 Ball Bga (8Mm X 10.5Mm) Rohs, It, T&r |Integrated Silicon Solution (Issi) IS43DR82560C-25DBLI-TR
IC DRAM 2GBIT PARALLEL 60TWBGA
DRAM 2G 256Mx8 400MHz DDR2 1.8V
2G, 1.8V, Ddr2, 256Mx8, 400Mhz @ Cl5, 60 Ball Bga (8Mm X 10.5Mm) Rohs, It, T&r |Integrated Silicon Solution (Issi) IS43DR82560C-25DBLI-TR
The three parts on the right have similar specifications to IS43DR82560C-25DBLI-TR.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountNumber of PinsNumber of TerminationsAdditional FeatureTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of PortsOperating ModeSupply Current-MaxOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthLengthHeight Seated (Max)WidthECCN CodePeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeView Compare
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IS43DR82560C-25DBLI-TR8 WeeksSurface Mount60-TFBGA-40°C~85°C TATape & Reel (TR)Active3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 256M x 8Volatile400MHz400psDRAMParallel15nsROHS3 Compliant--------------------------------
-
14 WeeksSurface Mount90-LFBGA0°C~70°C TATrayActive3 (168 Hours)SDRAM - Mobile LPDDR1.7V~1.95V64Mb 2M x 32Volatile166MHz5.5nsDRAMParallel15nsROHS3 CompliantYES9090AUTO/SELF REFRESHBOTTOM11.8V0.8mmNot Qualified1.95V1.8V1.7V1SYNCHRONOUS0.22mA32MX323-STATE320.00002A1073741824 bitCOMMON8192248162481613mm1.45mm8mm----
-
8 WeeksSurface Mount60-TFBGA-40°C~85°C TATape & Reel (TR)Active3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 256M x 8Volatile333MHz450psDRAMParallel15nsROHS3 Compliant-------------------------------
-
8 WeeksSurface Mount60-TFBGA-40°C~85°C TATrayActive3 (168 Hours)SDRAM - DDR2.3V~2.7V512Mb 32M x 16Volatile200MHz700psDRAMParallel15nsROHS3 CompliantYES-60PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESHBOTTOM12.5V1mm-2.7V-2.3V1SYNCHRONOUS-32MX16-16-536870912 bit----13mm1.2mm8mmEAR99NOT SPECIFIEDNOT SPECIFIEDR-PBGA-B60
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