ISSI, Integrated Silicon Solution Inc IS43DR16128C-25DBLI-TR
- Part Number:
- IS43DR16128C-25DBLI-TR
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 7373038-IS43DR16128C-25DBLI-TR
- Description:
- Memory IC
- Datasheet:
- IS43DR16128C-25DBLI-TR
ISSI, Integrated Silicon Solution Inc IS43DR16128C-25DBLI-TR technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS43DR16128C-25DBLI-TR.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case84-TFBGA
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - DDR2
- Voltage - Supply1.7V~1.9V
- Memory Size2Gb 128M x 16
- Memory TypeVolatile
- Clock Frequency400MHz
- Access Time400ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page15ns
- RoHS StatusROHS3 Compliant
IS43DR16128C-25DBLI-TR Overview
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 84-TFBGA, it is embedded within the case. A memory chip with a capacity of 2Gb 128M x 16 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.9V. As far as the mounting type is concerned, Surface Mount is recommended. In the memory, there is a clock frequency rotation that ranges 400MHz.
IS43DR16128C-25DBLI-TR Features
Package / Case: 84-TFBGA
IS43DR16128C-25DBLI-TR Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43DR16128C-25DBLI-TR Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
As far as memory types are concerned, Volatile is considered to be its memory type. In addition, memory ics is available in a Tape & Reel (TR) case as well. In the case of 84-TFBGA, it is embedded within the case. A memory chip with a capacity of 2Gb 128M x 16 is used on this device. There is a mainstream memory format used by this device, which is called DRAM-format memory. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. It is capable of handling a voltage supply of 1.7V~1.9V. As far as the mounting type is concerned, Surface Mount is recommended. In the memory, there is a clock frequency rotation that ranges 400MHz.
IS43DR16128C-25DBLI-TR Features
Package / Case: 84-TFBGA
IS43DR16128C-25DBLI-TR Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS43DR16128C-25DBLI-TR Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
IS43DR16128C-25DBLI-TR More Descriptions
SDRAM - DDR2 Memory IC 2Gb (128M x 16) Parallel 400 MHz 400 ns 84-TWBGA (8x12.5)
DRAM Chip DDR2 SDRAM 2Gbit 128M X 16 1.8V 84-Pin TWBGA T/R
DRAM DDR2,2G,1.8V, RoHs 400MHz,128Mx16, IT
IC DRAM 2GBIT PARALLEL 84TWBGA
2G, 1.8V, Ddr2, 128Mx16, 400Mhz @ Cl5, 84 Ball Bga (8Mm X 12.5Mm) Rohs, It, T&r |Integrated Silicon Solution (Issi) IS43DR16128C-25DBLI-TR
DRAM Chip DDR2 SDRAM 2Gbit 128M X 16 1.8V 84-Pin TWBGA T/R
DRAM DDR2,2G,1.8V, RoHs 400MHz,128Mx16, IT
IC DRAM 2GBIT PARALLEL 84TWBGA
2G, 1.8V, Ddr2, 128Mx16, 400Mhz @ Cl5, 84 Ball Bga (8Mm X 12.5Mm) Rohs, It, T&r |Integrated Silicon Solution (Issi) IS43DR16128C-25DBLI-TR
The three parts on the right have similar specifications to IS43DR16128C-25DBLI-TR.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusMountNumber of PinsNumber of TerminationsECCN CodeAdditional FeatureHTS CodeTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchPin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsNominal Supply CurrentData Bus WidthOrganizationOutput CharacteristicsMemory WidthAddress Bus WidthDensityStandby Current-MaxI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthLengthHeight Seated (Max)Radiation HardeningLead FreeSurface MountPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeOperating ModeMemory DensityWidthView Compare
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IS43DR16128C-25DBLI-TR8 WeeksSurface Mount84-TFBGA-40°C~85°C TATape & Reel (TR)Active3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 128M x 16Volatile400MHz400nsDRAMParallel15nsROHS3 Compliant---------------------------------------
-
8 WeeksSurface Mount66-TSSOP (0.400, 10.16mm Width)-40°C~85°C TATrayActive3 (168 Hours)SDRAM - DDR2.3V~2.7V256Mb 16M x 16Volatile200MHz700psDRAMParallel15nsROHS3 CompliantSurface Mount6666EAR99AUTO/SELF REFRESH8542.32.00.24DUAL12.5V0.65mm662.5V2.7V2.3V1330mA16b16MX163-STATE1615b256 Mb0.004ACOMMON819224824822.22mm1.2mmNoLead Free-------
-
8 WeeksSurface Mount60-TFBGA-40°C~85°C TATape & Reel (TR)Active3 (168 Hours)SDRAM - DDR21.7V~1.9V2Gb 256M x 8Volatile400MHz400psDRAMParallel15nsROHS3 Compliant--------------------------------------
-
8 WeeksSurface Mount60-TFBGA-40°C~85°C TATrayActive3 (168 Hours)SDRAM - DDR2.3V~2.7V512Mb 32M x 16Volatile200MHz700psDRAMParallel15nsROHS3 Compliant--60EAR99PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH-BOTTOM12.5V1mm--2.7V2.3V1--32MX16-16-------13mm1.2mm--YESNOT SPECIFIEDNOT SPECIFIEDR-PBGA-B60SYNCHRONOUS536870912 bit8mm
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