EDB4064B4PB-1DIT-F-R TR

Micron Technology Inc. EDB4064B4PB-1DIT-F-R TR

Part Number:
EDB4064B4PB-1DIT-F-R TR
Manufacturer:
Micron Technology Inc.
Ventron No:
7374430-EDB4064B4PB-1DIT-F-R TR
Description:
Memory IC
ECAD Model:
Datasheet:
EDB4064B4PB-1DIT-F-R TR

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Specifications
Micron Technology Inc. EDB4064B4PB-1DIT-F-R TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. EDB4064B4PB-1DIT-F-R TR.
  • Factory Lead Time
    9 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    216-WFBGA
  • Operating Temperature
    -40°C~85°C TC
  • Packaging
    Tape & Reel (TR)
  • Part Status
    Last Time Buy
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Technology
    SDRAM - Mobile LPDDR2
  • Voltage - Supply
    1.14V~1.95V
  • Memory Size
    4Gb 64M x 64
  • Memory Type
    Volatile
  • Clock Frequency
    533MHz
  • Memory Format
    DRAM
  • Memory Interface
    Parallel
  • RoHS Status
    ROHS3 Compliant
Description
EDB4064B4PB-1DIT-F-R TR Overview
There is a Volatile memory type associated with this device. Tape & Reel (TR)-cases are available. There is a 216-WFBGA case embedded in it. 4Gb 64M x 64 is the chip's memory size. DRAM-format memory is used in this device, which is a mainstream design. Due to its wide operating temperature range, this device can be used in a wide variety of demanding applications. The supply voltage can be up to 1.14V~1.95V. A Surface Mount mounting type is recommended for this product. In this memory, the clock frequency rotation is within an 533MHz range.

EDB4064B4PB-1DIT-F-R TR Features
Package / Case: 216-WFBGA


EDB4064B4PB-1DIT-F-R TR Applications
There are a lot of Micron Technology Inc.
EDB4064B4PB-1DIT-F-R TR Memory applications.


mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
EDB4064B4PB-1DIT-F-R TR More Descriptions
IC FLASH 8M PARALLEL 48TSOP
IC DRAM 4G PARALLEL 216WFBGA
Product Comparison
The three parts on the right have similar specifications to EDB4064B4PB-1DIT-F-R TR.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Voltage - Supply
    Memory Size
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    RoHS Status
    Surface Mount
    JESD-609 Code
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of Ports
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Access Mode
    Length
    Height Seated (Max)
    Width
    View Compare
  • EDB4064B4PB-1DIT-F-R TR
    EDB4064B4PB-1DIT-F-R TR
    9 Weeks
    Surface Mount
    216-WFBGA
    -40°C~85°C TC
    Tape & Reel (TR)
    Last Time Buy
    3 (168 Hours)
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    4Gb 64M x 64
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EDB4432BBBJ-1DAUT-F-D
    8 Weeks
    Surface Mount
    134-WFBGA
    -40°C~125°C TC
    Tray
    Active
    3 (168 Hours)
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    4Gb 128M x 32
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    YES
    e1
    134
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
    BOTTOM
    260
    1
    1.2V
    0.65mm
    30
    R-PBGA-B134
    1.95V
    1.14V
    1
    SYNCHRONOUS
    128MX32
    32
    4294967296 bit
    SINGLE BANK PAGE BURST
    11.5mm
    0.75mm
    10mm
  • EDB4432BBBJ-1DAAT-F-D
    8 Weeks
    Surface Mount
    134-WFBGA
    -40°C~105°C TC
    Tray
    Active
    3 (168 Hours)
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    4Gb 128M x 32
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    YES
    e1
    134
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
    BOTTOM
    260
    1
    1.2V
    0.65mm
    30
    R-PBGA-B134
    1.95V
    1.14V
    1
    SYNCHRONOUS
    128MX32
    32
    4294967296 bit
    SINGLE BANK PAGE BURST
    11.5mm
    0.75mm
    10mm
  • EDB4432BBPE-1D-F-D
    8 Weeks
    Surface Mount
    FBGA
    -30°C~85°C TC
    Tray
    Active
    3 (168 Hours)
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    4Gb 128M x 32
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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