XCKU115-2FLVB2104E

Xilinx Inc. XCKU115-2FLVB2104E

Part Number:
XCKU115-2FLVB2104E
Manufacturer:
Xilinx Inc.
Ventron No:
3637815-XCKU115-2FLVB2104E
Description:
IC FPGA 702 I/O 2104FCBGA
ECAD Model:
Datasheet:
Wireless Bluetooth® Low Energy Modules Overview

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XCKU115-2FLVB2104E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU115-2FLVB2104E.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    2104-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Bulk
  • Series
    Kintex® UltraScale™
  • Published
    2012
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A001.A.7.B
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Packing Method
    TRAY
  • Technology
    CMOS
  • Voltage - Supply
    0.922V~0.979V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.95V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B2104
  • Number of Outputs
    702
  • Qualification Status
    Not Qualified
  • Power Supplies
    0.95V
  • Number of I/O
    702
  • RAM Size
    9.5MB
  • Number of Inputs
    702
  • Organization
    5520 CLBS
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    1451100
  • Total RAM Bits
    77721600
  • Number of LABs/CLBs
    82920
  • Number of CLBs
    5520
  • Length
    40mm
  • Height Seated (Max)
    3.71mm
  • Width
    40mm
  • RoHS Status
    ROHS3 Compliant
Description
XCKU115-2FLVB2104E Overview
This package is included in the 2104-BBGA, FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 0.95V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 0.922V~0.979V . An FPGA belonging to the Kintex® UltraScale™ series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. With this device, you will be able to make use of 702 outputs. Using the Bulk layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 77721600 RAM bits in terms of its RAM si77721600e. During the configuration of this FPGA module, the RAM si9.5MBe reaches 9.5MB to ensure that the program runs normally. An array of 82920 LABs/CLBs is built into the FPGA. It is powered by a 0.95V battery, which can be purchased separately. CLBs are the building blocks of its architecture. Adapted packing method is TRAY, to suit the majority of industrial design needs.

XCKU115-2FLVB2104E Features
702 I/Os
Up to 77721600 RAM bits


XCKU115-2FLVB2104E Applications
There are a lot of Xilinx Inc.
XCKU115-2FLVB2104E FPGAs applications.


ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
XCKU115-2FLVB2104E More Descriptions
FPGA Kintex UltraScale 1160880 Cells 20nm Technology 0.95V 2104-Pin FCBGA Tray
Field Programmable Gate Array, 5520 CLBs, 1451100-Cell, PBGA2104
FPGA, KINTEX ULTRASCALE, FCBGA-2104
Fpga, Kintex Ultrascale, Fcbga-2104; No. Of Logic Blocks:663360; No. Of Macrocells:1451100; Fpga Family:Kintex Ultrascale Series; Logic Case Style:Fcbga; No. Of Pins:2104Pins; No. Of Speed Grades:2; Total Ram Bits:77722Kbit; No. Of Rohs Compliant: Yes |Amd Xilinx XCKU115-2FLVB2104E
Product Comparison
The three parts on the right have similar specifications to XCKU115-2FLVB2104E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Packing Method
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    RAM Size
    Number of Inputs
    Organization
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Number of CLBs
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Contact Plating
    Mount
    Number of Pins
    Number of Terminations
    Reflow Temperature-Max (s)
    Operating Supply Voltage
    Speed Grade
    Number of Registers
    View Compare
  • XCKU115-2FLVB2104E
    XCKU115-2FLVB2104E
    10 Weeks
    Surface Mount
    2104-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Bulk
    Kintex® UltraScale™
    2012
    e1
    Active
    4 (72 Hours)
    3A001.A.7.B
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    1mm
    NOT SPECIFIED
    S-PBGA-B2104
    702
    Not Qualified
    0.95V
    702
    9.5MB
    702
    5520 CLBS
    FIELD PROGRAMMABLE GATE ARRAY
    1451100
    77721600
    82920
    5520
    40mm
    3.71mm
    40mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCKU035-1FBVA900C
    10 Weeks
    Surface Mount
    900-BBGA, FCBGA
    -
    0°C~85°C TJ
    Bulk
    Kintex® UltraScale™
    2012
    e1
    Active
    4 (72 Hours)
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    -
    -
    -
    468
    Not Qualified
    0.95V
    468
    2.4MB
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    444343
    19456000
    25391
    -
    -
    2.8mm
    -
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    900
    900
    NOT SPECIFIED
    950mV
    1
    406256
  • XCKU115-2FLVA2104E
    10 Weeks
    Surface Mount
    2104-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Bulk
    Kintex® UltraScale™
    2012
    e1
    Active
    4 (72 Hours)
    3A001.A.7.B
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    1mm
    NOT SPECIFIED
    S-PBGA-B2104
    832
    Not Qualified
    0.95V
    832
    -
    832
    5520 CLBS
    FIELD PROGRAMMABLE GATE ARRAY
    1451100
    77721600
    82920
    5520
    40mm
    3.71mm
    40mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • XCKU040-L1FFVA1156I
    10 Weeks
    Surface Mount
    1156-BBGA, FCBGA
    YES
    -40°C~100°C TJ
    Bulk
    Kintex® UltraScale™
    2012
    e1
    Active
    4 (72 Hours)
    3A991.D
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.880V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.9V
    1mm
    -
    S-PBGA-B1156
    520
    Not Qualified
    0.9V
    520
    2.6MB
    520
    1920 CLBS
    FIELD PROGRAMMABLE GATE ARRAY
    530250
    21606000
    30300
    1920
    35mm
    3.51mm
    35mm
    ROHS3 Compliant
    -
    -
    -
    -
    NOT SPECIFIED
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 06 September 2023

    TDA8356 Specifications, Characteristics and Application Circuits

    Ⅰ. Overview of TDA8356TDA8356 is a new field scanning output integrated circuit produced by Philips of the Netherlands. It is widely used in various domestic and imported large-screen...
  • 06 September 2023

    All You Need to Know About MPS2222A

    Ⅰ. Overview of MPS2222AMPS2222A is an NPN transistor produced by Fairchild Semiconductor. Its main features include power dissipation of 0.625W; collector current of 0.6A; maximum withstand voltage of...
  • 06 September 2023

    A4988 Characteristics, Application and Basic Principle

    A4988 is an efficient and commonly used stepper motor driver chip, widely used in 3D printing and CNC machine tools and other fields. We will discuss in depth...
  • 07 September 2023

    What Is The Difference Between NE5532 And RC4558D?

    Ⅰ. Overview of NE5532NE5532 is a dual operational amplifier chip with excellent performance and low noise characteristics. Its circuit design is similar to that of a common operational...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.