XCKU115-3FLVB1760E

Xilinx Inc. XCKU115-3FLVB1760E

Part Number:
XCKU115-3FLVB1760E
Manufacturer:
Xilinx Inc.
Ventron No:
4542821-XCKU115-3FLVB1760E
Description:
IC FPGA 702 I/O 1760FCBGA
ECAD Model:
Datasheet:
Wireless Bluetooth® Low Energy Modules Overview

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Specifications
Xilinx Inc. XCKU115-3FLVB1760E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU115-3FLVB1760E.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    1760-BBGA, FCBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Bulk
  • Series
    Kintex® UltraScale™
  • Published
    2012
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A001.A.7.B
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Packing Method
    TRAY
  • Technology
    CMOS
  • Voltage - Supply
    0.970V~1.030V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B1760
  • Number of Outputs
    702
  • Qualification Status
    Not Qualified
  • Power Supplies
    1V
  • Number of I/O
    702
  • Number of Inputs
    702
  • Organization
    5520 CLBS
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    1451100
  • Total RAM Bits
    77721600
  • Number of LABs/CLBs
    82920
  • Number of CLBs
    5520
  • Length
    42.5mm
  • Height Seated (Max)
    3.71mm
  • Width
    42.5mm
  • RoHS Status
    ROHS3 Compliant
Description
XCKU115-3FLVB1760E Overview
A 1760-BBGA, FCBGA package contains it, and it is available for download. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Its 702 I/Os help it transfer data more efficiently. A fundamental building block contains 1451100 logic elements or cells. Power is provided by a 1V-volt supply. An FPGA part from the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 0.970V~1.030V and uses a battery to supply power. FPGAs belonging to the Kintex® UltraScale™ series are a type of FPGA that belong to the Kintex® UltraScale™ series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. During the installation of this device, 702 outputs were incorporated. A model of this FPGA is contained in Bulk for the purpose of saving space. Having a RAM bit size of 77721600 means that this device will offer you a lot of memory. 82920 LABs/CLBs are integrated into this FPGA. Power is supplied to the device by a 1V battery. In order to make the architecture work, 5520 CLBs are used. Due to fpga circuits adaptabilfpga circuity, fpga circuit uses TRAY packing methods for most industry purposes.

XCKU115-3FLVB1760E Features
702 I/Os
Up to 77721600 RAM bits


XCKU115-3FLVB1760E Applications
There are a lot of Xilinx Inc.
XCKU115-3FLVB1760E FPGAs applications.


Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
XCKU115-3FLVB1760E More Descriptions
FPGA Kintex UltraScale 1160880 Cells 20nm Technology 1V 1760-Pin FCBGA Tray
IC FPGA 702 I/O 1760FCBGA
Product Comparison
The three parts on the right have similar specifications to XCKU115-3FLVB1760E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Packing Method
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    Number of Inputs
    Organization
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Number of CLBs
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Contact Plating
    Mount
    Number of Pins
    Number of Terminations
    Reflow Temperature-Max (s)
    Operating Supply Voltage
    RAM Size
    Speed Grade
    Number of Registers
    Lead Free
    View Compare
  • XCKU115-3FLVB1760E
    XCKU115-3FLVB1760E
    10 Weeks
    Surface Mount
    1760-BBGA, FCBGA
    YES
    0°C~100°C TJ
    Bulk
    Kintex® UltraScale™
    2012
    e1
    Active
    4 (72 Hours)
    3A001.A.7.B
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.39.00.01
    Field Programmable Gate Arrays
    TRAY
    CMOS
    0.970V~1.030V
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    NOT SPECIFIED
    S-PBGA-B1760
    702
    Not Qualified
    1V
    702
    702
    5520 CLBS
    FIELD PROGRAMMABLE GATE ARRAY
    1451100
    77721600
    82920
    5520
    42.5mm
    3.71mm
    42.5mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCKU040-1FBVA676C
    10 Weeks
    Surface Mount
    676-BBGA, FCBGA
    -
    0°C~85°C TJ
    Tray
    Kintex® UltraScale™
    2012
    e1
    Active
    4 (72 Hours)
    -
    Tin/Silver/Copper (Sn/Ag/Cu)
    -
    Field Programmable Gate Arrays
    -
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    -
    -
    -
    312
    Not Qualified
    0.95V
    312
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    530250
    21606000
    30300
    -
    27mm
    -
    27mm
    ROHS3 Compliant
    Copper, Silver, Tin
    Surface Mount
    676
    676
    NOT SPECIFIED
    950mV
    2.6MB
    1
    484800
    -
  • XCKU5P-L1FFVA676I
    11 Weeks
    Surface Mount
    676-BBGA, FCBGA
    -
    -40°C~100°C TJ
    Tray
    Kintex® UltraScale ™
    -
    -
    Active
    4 (72 Hours)
    -
    -
    8542.39.00.01
    -
    -
    -
    0.698V~0.876V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    256
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    474600
    41984000
    27120
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XCKU025-2FFVA1156E
    10 Weeks
    Surface Mount
    1156-BBGA, FCBGA
    -
    0°C~100°C TJ
    Bulk
    Kintex® UltraScale™
    2012
    -
    Active
    4 (72 Hours)
    -
    -
    -
    -
    TRAY
    CMOS
    0.922V~0.979V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.95V
    1mm
    -
    S-PBGA-B1156
    312
    -
    -
    312
    312
    -
    FIELD PROGRAMMABLE GATE ARRAY
    318150
    13004800
    18180
    -
    35mm
    3.51mm
    35mm
    ROHS3 Compliant
    -
    Surface Mount
    -
    -
    NOT SPECIFIED
    950mV
    1.6MB
    2
    290880
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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