Xilinx Inc. XCKU040-L1FFVA1156I
- Part Number:
- XCKU040-L1FFVA1156I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4542310-XCKU040-L1FFVA1156I
- Description:
- IC FPGA 520 I/O 1156FCBGA
Xilinx Inc. XCKU040-L1FFVA1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU040-L1FFVA1156I.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingBulk
- Published2012
- SeriesKintex® UltraScale™
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- Packing MethodTRAY
- TechnologyCMOS
- Voltage - Supply0.880V~0.979V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.9V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B1156
- Number of Outputs520
- Qualification StatusNot Qualified
- Power Supplies0.9V
- Number of I/O520
- RAM Size2.6MB
- Number of Inputs520
- Organization1920 CLBS
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells530250
- Total RAM Bits21606000
- Number of LABs/CLBs30300
- Number of CLBs1920
- Height Seated (Max)3.51mm
- Length35mm
- Width35mm
- RoHS StatusROHS3 Compliant
XCKU040-L1FFVA1156I Overview
Xilinx Inc. is a well-known brand in the field of electronic components, particularly in the area of Embedded - FPGAs (Field Programmable Gate Array) chips. This specific chip falls under the category of Embedded - FPGAs (Field Programmable Gate Array), which is a type of integrated circuit that can be programmed and reconfigured to perform various tasks. The package or case for this chip is 1156-BBGA or FCBGA, which refers to the type of packaging used for the chip. This chip can operate in a wide temperature range of -40°C to 100°C, making it suitable for use in a variety of environments. Its Moisture Sensitivity Level (MSL) is 4, which means it can withstand exposure to moisture for up to 72 hours without being damaged. The terminal finish for this chip is Tin/Silver/Copper (Sn/Ag/Cu), which is a commonly used combination of metals for electronic components. The peak reflow temperature for this chip is not specified, indicating that it can withstand high temperatures without any adverse effects. The JESD-30 Code for this chip is S-PBGA-B1156, which is a standard code used to identify the specific type of package for the chip. This chip has an impressive 520 outputs, which means it can handle a large amount of data and perform complex tasks. It also has a RAM size of 2.6MB, which is a measure of its memory capacity. The programmable logic type for this chip is FIELD PROGRAMMABLE GATE ARRAY, which means it can be programmed and reconfigured to perform different functions. Finally, the number of logic elements/cells for this chip is 530250, which is a measure of its processing power and ability to handle complex algorithms. Overall, the Xilinx Inc. Embedded - FPGAs chip offers high performance, versatility, and reliability, making it a popular choice among electronic manufacturers and designers.
XCKU040-L1FFVA1156I Features
520 I/Os
Up to 21606000 RAM bits
XCKU040-L1FFVA1156I Applications
There are a lot of Xilinx Inc. XCKU040-L1FFVA1156I FPGAs applications.
Defense Applications
Software-defined radio
Bioinformatics
Embedded Vision
Image processing
Camera time adjustments
Data Center
Automation
Industrial Ethernet
Solar Energy
Xilinx Inc. is a well-known brand in the field of electronic components, particularly in the area of Embedded - FPGAs (Field Programmable Gate Array) chips. This specific chip falls under the category of Embedded - FPGAs (Field Programmable Gate Array), which is a type of integrated circuit that can be programmed and reconfigured to perform various tasks. The package or case for this chip is 1156-BBGA or FCBGA, which refers to the type of packaging used for the chip. This chip can operate in a wide temperature range of -40°C to 100°C, making it suitable for use in a variety of environments. Its Moisture Sensitivity Level (MSL) is 4, which means it can withstand exposure to moisture for up to 72 hours without being damaged. The terminal finish for this chip is Tin/Silver/Copper (Sn/Ag/Cu), which is a commonly used combination of metals for electronic components. The peak reflow temperature for this chip is not specified, indicating that it can withstand high temperatures without any adverse effects. The JESD-30 Code for this chip is S-PBGA-B1156, which is a standard code used to identify the specific type of package for the chip. This chip has an impressive 520 outputs, which means it can handle a large amount of data and perform complex tasks. It also has a RAM size of 2.6MB, which is a measure of its memory capacity. The programmable logic type for this chip is FIELD PROGRAMMABLE GATE ARRAY, which means it can be programmed and reconfigured to perform different functions. Finally, the number of logic elements/cells for this chip is 530250, which is a measure of its processing power and ability to handle complex algorithms. Overall, the Xilinx Inc. Embedded - FPGAs chip offers high performance, versatility, and reliability, making it a popular choice among electronic manufacturers and designers.
XCKU040-L1FFVA1156I Features
520 I/Os
Up to 21606000 RAM bits
XCKU040-L1FFVA1156I Applications
There are a lot of Xilinx Inc. XCKU040-L1FFVA1156I FPGAs applications.
Defense Applications
Software-defined radio
Bioinformatics
Embedded Vision
Image processing
Camera time adjustments
Data Center
Automation
Industrial Ethernet
Solar Energy
XCKU040-L1FFVA1156I More Descriptions
FPGA Kintex UltraScale Family 424200 Cells 0.95V 1156-Pin FC-BGA
Kintex UltraScale FPGA, 108 User I/Os, 0 GTP, 325-Ball BGA, Speed Grade 3, Extended Grade, FFVA1156, RoHSXilinx SCT
Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA1156
FPGA, KINTEX ULTRASCALE, 520 I/O, FCBGA
FPGA, KINTEX ULTRASCALE, 520 I/O, FCBGA; No. of Logic Blocks:242400; No. of Macrocells:530250Macrocells; FPGA Family:Kintex UltraScale; Logic Case Style:FCBGA; No. of Pins:1156Pins; No. of Speed Grades:-; Total RAM Bits:21100Kbit RoHS Compliant: Yes
Kintex UltraScale FPGA, 108 User I/Os, 0 GTP, 325-Ball BGA, Speed Grade 3, Extended Grade, FFVA1156, RoHSXilinx SCT
Field Programmable Gate Array, 1920 CLBs, 530250-Cell, PBGA1156
FPGA, KINTEX ULTRASCALE, 520 I/O, FCBGA
FPGA, KINTEX ULTRASCALE, 520 I/O, FCBGA; No. of Logic Blocks:242400; No. of Macrocells:530250Macrocells; FPGA Family:Kintex UltraScale; Logic Case Style:FCBGA; No. of Pins:1156Pins; No. of Speed Grades:-; Total RAM Bits:21100Kbit RoHS Compliant: Yes
The three parts on the right have similar specifications to XCKU040-L1FFVA1156I.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)ECCN CodeTerminal FinishHTS CodeSubcategoryPacking MethodTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusPower SuppliesNumber of I/ORAM SizeNumber of InputsOrganizationProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of CLBsHeight Seated (Max)LengthWidthRoHS StatusContact PlatingMountTime@Peak Reflow Temperature-Max (s)Operating Supply VoltageSpeed GradeNumber of RegistersView Compare
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XCKU040-L1FFVA1156I10 WeeksSurface Mount1156-BBGA, FCBGAYES-40°C~100°C TJBulk2012Kintex® UltraScale™e1Active4 (72 Hours)3A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Field Programmable Gate ArraysTRAYCMOS0.880V~0.979VBOTTOMBALLNOT SPECIFIED0.9V1mmNOT SPECIFIEDS-PBGA-B1156520Not Qualified0.9V5202.6MB5201920 CLBSFIELD PROGRAMMABLE GATE ARRAY530250216060003030019203.51mm35mm35mmROHS3 Compliant-------
-
10 WeeksSurface Mount1760-BBGA, FCBGA--40°C~100°C TJBulk2012Kintex® UltraScale™e1Active4 (72 Hours)3A001.A.7.BTin/Silver/Copper (Sn/Ag/Cu)-Field Programmable Gate ArraysTRAYCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mm-S-PBGA-B1760702Not Qualified0.95V7029.5MB702-FIELD PROGRAMMABLE GATE ARRAY14511007772160082920-3.71mm--ROHS3 CompliantCopper, Silver, TinSurface MountNOT SPECIFIED950mV21.32672e 06
-
10 WeeksSurface Mount2104-BBGA, FCBGAYES0°C~100°C TJBulk2012Kintex® UltraScale™e1Active4 (72 Hours)3A001.A.7.BTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Field Programmable Gate ArraysTRAYCMOS0.922V~0.979VBOTTOMBALLNOT SPECIFIED0.95V1mm-S-PBGA-B2104832Not Qualified0.95V832-8325520 CLBSFIELD PROGRAMMABLE GATE ARRAY1451100777216008292055203.71mm40mm40mmROHS3 Compliant--NOT SPECIFIED---
-
11 WeeksSurface Mount676-BBGA, FCBGA--40°C~100°C TJTray-Kintex® UltraScale ™-Active4 (72 Hours)--8542.39.00.01---0.698V~0.876V----------256---FIELD PROGRAMMABLE GATE ARRAY4746004198400027120----ROHS3 Compliant------
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