Xilinx Inc. XCKU035-1FBVA900C

Name: XCKU035-1FBVA900C
Brand: Xilinx Inc.
SKU: 4542747-XCKU035-1FBVA900C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCKU035-1FBVA900C

Manufacturer:: Xilinx Inc.

Ventron No:: 4542747-XCKU035-1FBVA900C

Description:: IC FPGA 468 I/O 900FCBGA

ECAD Model:

Datasheet:: XCKU035-1FBVA900C

Specifications

Xilinx Inc. XCKU035-1FBVA900C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCKU035-1FBVA900C.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
900-BBGA, FCBGA
Number of Pins
900
Operating Temperature
0°C~85°C TJ
Packaging
Bulk
Published
2012
Series
Kintex® UltraScale™
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
900
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Field Programmable Gate Arrays
Packing Method
TRAY
Technology
CMOS
Voltage - Supply
0.922V~0.979V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.95V
Reflow Temperature-Max (s)
NOT SPECIFIED
Number of Outputs
468
Qualification Status
Not Qualified
Operating Supply Voltage
950mV
Power Supplies
0.95V
Number of I/O
468
RAM Size
2.4MB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
444343
Total RAM Bits
19456000
Number of LABs/CLBs
25391
Speed Grade
1
Number of Registers
406256
Height Seated (Max)
2.8mm
RoHS Status
ROHS3 Compliant

Description

XCKU035-1FBVA900C Overview
The manufacturer of this component is Xilinx Inc., a company specializing in Embedded - FPGAs (Field Programmable Gate Array) technology. This particular chip falls under the Embedded - FPGAs category. It has 900 pins and can operate within a temperature range of 0°C to 85°C. The packaging for this chip is bulk. It is part of the Kintex® UltraScale™ series. The terminal finish is made of Tin/Silver/Copper (Sn/Ag/Cu). The voltage supply for this chip ranges from 0.922V to 0.979V. The maximum reflow temperature is not specified. It requires a power supply of 0.95V and has 468 input/output connections. The maximum seated height is 2.8mm.

XCKU035-1FBVA900C Features
468 I/Os
Up to 19456000 RAM bits
900 LABs/CLBs
406256 registers

XCKU035-1FBVA900C Applications
There are a lot of Xilinx Inc. XCKU035-1FBVA900C FPGAs applications.

Data center search engines
ADAS
Bioinformatics
Camera time adjustments
Embedded Vision
Broadcast
Medical imaging
Audio
Automotive
Scientific Instruments

XCKU035-1FBVA900C More Descriptions

FPGA Kintex UltraScale 355474 Cells 20nm Technology 0.95V 900-Pin FC-BGA
Field Programmable Gate Array, 1700 CLBs, 444343-Cell, PBGA900
FPGA, KINTEX ULTRASCALE, 468 I/O, FCBGA;
PANASONIC DZ2S360M0L DIODE, ZENER, 36.0V, SSMINI2-F5-B
FPGA, 630MHZ, FCBGA-900; No. of Logic Cells:444343Logic Cells; IC Case / Package:FCBGA; No. of Pins:900Pins; No.of User I/Os:468I/O s; Product Range:Kintex UltraScale XCKU035; Clock Management:MMCM, PLL; Core Supply Voltage Max:979mVRoHS Compliant: Yes

Product Comparison

The three parts on the right have similar specifications to XCKU035-1FBVA900C.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Packing Method

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Reflow Temperature-Max (s)

Number of Outputs

Qualification Status

Operating Supply Voltage

Power Supplies

Number of I/O

RAM Size

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Number of Registers

Height Seated (Max)

RoHS Status

ECCN Code

Terminal Pitch

Time@Peak Reflow Temperature-Max (s)

JESD-30 Code

Number of Inputs

HTS Code

Length

Width

Lead Free

View Compare
XCKU035-1FBVA900C

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

900-BBGA, FCBGA

900

0°C~85°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

900

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

NOT SPECIFIED

468

Not Qualified

950mV

0.95V

468

2.4MB

FIELD PROGRAMMABLE GATE ARRAY

444343

19456000

25391

1

406256

2.8mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-
XCKU115-2FLVB1760I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

1760-BBGA, FCBGA

-

-40°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

e1

Active

4 (72 Hours)

-

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

-

702

Not Qualified

950mV

0.95V

702

9.5MB

FIELD PROGRAMMABLE GATE ARRAY

1451100

77721600

82920

2

1.32672e 06

3.71mm

ROHS3 Compliant

3A001.A.7.B

1mm

NOT SPECIFIED

S-PBGA-B1760

702

-

-

-

-

XCKU035-1FBVA900C vs XCKU115-2FLVB1760I
XCKU5P-L1FFVA676I

Xilinx Inc.

11 Weeks

-

-

Surface Mount

676-BBGA, FCBGA

-

-40°C~100°C TJ

Tray

-

Kintex® UltraScale ™

-

Active

4 (72 Hours)

-

-

-

-

-

0.698V~0.876V

-

-

-

-

-

-

-

-

-

256

-

FIELD PROGRAMMABLE GATE ARRAY

474600

41984000

27120

-

-

-

ROHS3 Compliant

-

-

-

-

-

8542.39.00.01

-

-

-

XCKU035-1FBVA900C vs XCKU5P-L1FFVA676I
XCKU025-2FFVA1156E

Xilinx Inc.

10 Weeks

-

Surface Mount

Surface Mount

1156-BBGA, FCBGA

-

0°C~100°C TJ

Bulk

2012

Kintex® UltraScale™

-

Active

4 (72 Hours)

-

-

-

TRAY

CMOS

0.922V~0.979V

BOTTOM

BALL

NOT SPECIFIED

0.95V

NOT SPECIFIED

312

-

950mV

-

312

1.6MB

FIELD PROGRAMMABLE GATE ARRAY

318150

13004800

18180

2

290880

3.51mm

ROHS3 Compliant

-

1mm

-

S-PBGA-B1156

312

-

35mm

35mm

Lead Free

XCKU035-1FBVA900C vs XCKU025-2FFVA1156E