Xilinx Inc. XA7Z020-1CLG400Q
- Part Number:
- XA7Z020-1CLG400Q
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3828193-XA7Z020-1CLG400Q
- Description:
- IC SOC CORTEX A-9 ZYNQ7 400BGA
- Datasheet:
- XA7Z020-1CLG400Q
Xilinx Inc. XA7Z020-1CLG400Q technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XA7Z020-1CLG400Q.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Package / Case400-LFBGA, CSPBGA
- Number of Pins400
- Operating Temperature-40°C~125°C TJ
- PackagingTray
- Published2010
- SeriesAutomotive, AEC-Q100, Zynq®-7000 XA
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations400
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- SubcategoryOther uPs/uCs/Peripheral ICs
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Terminal Pitch0.8mm
- Frequency667MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- Qualification StatusNot Qualified
- Operating Supply Voltage1V
- Power Supplies11.8V
- InterfaceCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
- Number of I/O130
- RAM Size256KB
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR CIRCUIT
- Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
- PeripheralsDMA
- ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- ArchitectureMCU, FPGA
- Data Bus Width32b
- Core ArchitectureARM
- Primary AttributesArtix™-7 FPGA, 85K Logic Cells
- UV ErasableN
- Height Seated (Max)1.6mm
- Length17mm
- RoHS StatusROHS3 Compliant
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
The mount of the device is a surface mount, making it easy to install and secure onto a surface. Its ECCN code is EAR99, indicating that it is classified as a low-level technology product and can be exported without a license. The HTS code for this device is 8542.39.00.01, which classifies it as a semiconductor device. The technology used in this device is CMOS, which allows for low power consumption and high performance. It has a RAM size of 256KB, providing ample storage for data and instructions. The peripherals of this device include DMA, which allows for efficient data transfer. Its core architecture is ARM, a popular and powerful processor. The primary attributes of this device include an Artix™-7 FPGA, 85K logic cells, making it versatile and customizable for various applications. It is also UV erasable, allowing for easy reprogramming. Lastly, it is ROHS3 compliant, indicating that it is environmentally friendly and free of hazardous materials. Overall, this device is a high-quality and efficient product, suitable for a wide range of uses.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z020-1CLG400Q System On Chip (SoC) applications.
Vending machines
Smartphones
Transmitters
Temperature Sensors
Industrial sectors
Industrial transport
Sports
Video Imaging
Published Paper
Body control module
The mount of the device is a surface mount, making it easy to install and secure onto a surface. Its ECCN code is EAR99, indicating that it is classified as a low-level technology product and can be exported without a license. The HTS code for this device is 8542.39.00.01, which classifies it as a semiconductor device. The technology used in this device is CMOS, which allows for low power consumption and high performance. It has a RAM size of 256KB, providing ample storage for data and instructions. The peripherals of this device include DMA, which allows for efficient data transfer. Its core architecture is ARM, a popular and powerful processor. The primary attributes of this device include an Artix™-7 FPGA, 85K logic cells, making it versatile and customizable for various applications. It is also UV erasable, allowing for easy reprogramming. Lastly, it is ROHS3 compliant, indicating that it is environmentally friendly and free of hazardous materials. Overall, this device is a high-quality and efficient product, suitable for a wide range of uses.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z020-1CLG400Q System On Chip (SoC) applications.
Vending machines
Smartphones
Transmitters
Temperature Sensors
Industrial sectors
Industrial transport
Sports
Video Imaging
Published Paper
Body control module
XA7Z020-1CLG400Q More Descriptions
MPU Zynq-7000 RISC 32-Bit 667MHz 1.8V/3.3V 400-Pin CS-BGA
Microprocessor Circuit, CMOS, PBGA400
Processors - Application Specialized XA7Z020-1CLG400Q
IC SOC CORTEX-A9 667MHZ 485CSBGA
Product Description Demo for Development.
XA7Z020-1CLG400Q ROHS COMPLIANT: YES
Microprocessor Circuit, CMOS, PBGA400
Processors - Application Specialized XA7Z020-1CLG400Q
IC SOC CORTEX-A9 667MHZ 485CSBGA
Product Description Demo for Development.
XA7Z020-1CLG400Q ROHS COMPLIANT: YES
The three parts on the right have similar specifications to XA7Z020-1CLG400Q.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountPackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Terminal PitchFrequencyReflow Temperature-Max (s)Qualification StatusOperating Supply VoltagePower SuppliesInterfaceNumber of I/ORAM SizeuPs/uCs/Peripheral ICs TypeCore ProcessorPeripheralsConnectivityArchitectureData Bus WidthCore ArchitecturePrimary AttributesUV ErasableHeight Seated (Max)LengthRoHS StatusSurface MountReach Compliance CodeJESD-30 CodeSpeedWidthView Compare
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XA7Z020-1CLG400Q10 WeeksCopper, Silver, TinSurface Mount400-LFBGA, CSPBGA400-40°C~125°C TJTray2010Automotive, AEC-Q100, Zynq®-7000 XAe1Active3 (168 Hours)400EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Other uPs/uCs/Peripheral ICsCMOSBOTTOMBALLNOT SPECIFIED0.8mm667MHzNOT SPECIFIEDNot Qualified1V11.8VCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMArtix™-7 FPGA, 85K Logic CellsN1.6mm17mmROHS3 Compliant------
-
10 WeeksCopper, Silver, TinSurface Mount484-LFBGA, CSPBGA484-40°C~125°C TJTray2009Automotive, AEC-Q100, Zynq®-7000 XAe1Active3 (168 Hours)4843A991.DTIN SILVER COPPER8542.39.00.01Other uPs/uCs/Peripheral ICsCMOSBOTTOMBALLNOT SPECIFIED0.8mm667MHzNOT SPECIFIEDNot Qualified1V11.8VCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMArtix™-7 FPGA, 85K Logic CellsN1.6mm19mmROHS3 Compliant-----
-
10 WeeksCopper, Silver, TinSurface Mount400-LFBGA, CSPBGA400-40°C~100°C TJTray2010Automotive, AEC-Q100, Zynq®-7000 XAe1Active4 (72 Hours)400EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Other uPs/uCs/Peripheral ICsCMOSBOTTOMBALLNOT SPECIFIED0.8mm667MHzNOT SPECIFIEDNot Qualified1V11.8VCAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB130256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA32bARMArtix™-7 FPGA, 85K Logic CellsN1.6mm17mmROHS3 Compliant-----
-
---484-BBGA, FCBGA--40°C~100°C TJTray2010Automotive, AEC-Q100, Zynq®-7000 XAe1Obsolete4 (72 Hours)484EAR99Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.01Other uPs/uCs/Peripheral ICsCMOSBOTTOMBALL2501mm-30Not Qualified-11.8V-130256KBMICROPROCESSOR CIRCUITDual ARM® Cortex®-A9 MPCore™ with CoreSight™DMACANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTGMCU, FPGA--Kintex™-7 FPGA, 125K Logic CellsN2.54mm23mmRoHS CompliantYESnot_compliantS-PBGA-B484667MHz23mm
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