Micron Technology Inc. NAND512R3A2CZA6E
- Part Number:
- NAND512R3A2CZA6E
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3731120-NAND512R3A2CZA6E
- Description:
- IC FLASH 512MBIT 63VFBGA
- Datasheet:
- NAND512-A2C
Micron Technology Inc. NAND512R3A2CZA6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND512R3A2CZA6E.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case63-TFBGA
- Number of Pins63
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2009
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations64
- TechnologyFLASH - NAND
- Voltage - Supply1.7V~1.95V
- Terminal PositionBOTTOM
- Supply Voltage1.8V
- Terminal Pitch0.8mm
- Base Part NumberNAND512-A
- JESD-30 CodeR-PBGA-B64
- Operating Supply Voltage1.8V
- Memory Size512Mb 64M x 8
- Nominal Supply Current15mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization64MX8
- Memory Width8
- Write Cycle Time - Word, Page50ns
- Address Bus Width26b
- Density512 Mb
- Standby Current-Max0.00005A
- Access Time (Max)45 ns
- Sync/AsyncAsynchronous
- Word Size8b
- Data PollingNO
- Toggle BitNO
- Command User InterfaceYES
- Number of Sectors/Size4K
- Sector Size16K
- Page Size512words
- Ready/BusyYES
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
NAND512R3A2CZA6E Overview
The surface mount product has 63 pins and can operate in temperatures ranging from -40°C to 85°C. It was published in 2009 and has 64 terminations. The organization of this product is 64MX8 and it has a write cycle time of 50ns for both word and page. The density of this product is 512 Mb and it can be used in both synchronous and asynchronous applications. However, it does not have radiation hardening capabilities.
NAND512R3A2CZA6E Features
Package / Case: 63-TFBGA
63 Pins
Operating Supply Voltage:1.8V
NAND512R3A2CZA6E Applications
There are a lot of Micron Technology Inc.
NAND512R3A2CZA6E Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
The surface mount product has 63 pins and can operate in temperatures ranging from -40°C to 85°C. It was published in 2009 and has 64 terminations. The organization of this product is 64MX8 and it has a write cycle time of 50ns for both word and page. The density of this product is 512 Mb and it can be used in both synchronous and asynchronous applications. However, it does not have radiation hardening capabilities.
NAND512R3A2CZA6E Features
Package / Case: 63-TFBGA
63 Pins
Operating Supply Voltage:1.8V
NAND512R3A2CZA6E Applications
There are a lot of Micron Technology Inc.
NAND512R3A2CZA6E Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
NAND512R3A2CZA6E More Descriptions
SLC NAND Flash Parallel 1.8V 512Mbit 64M x 8bit 15us 63-Pin VFBGA Tray
R-PBGA-B64 Surface Mount NAND512-A Tray ic memory 45ns 0.8mm 15mA 512Mb
IC FLSH 512MBIT PARALLEL 63VFBGA
R-PBGA-B64 Surface Mount NAND512-A Tray ic memory 45ns 0.8mm 15mA 512Mb
IC FLSH 512MBIT PARALLEL 63VFBGA
The three parts on the right have similar specifications to NAND512R3A2CZA6E.
-
ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionSupply VoltageTerminal PitchBase Part NumberJESD-30 CodeOperating Supply VoltageMemory SizeNominal Supply CurrentMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxAccess Time (Max)Sync/AsyncWord SizeData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyRadiation HardeningRoHS StatusJESD-609 CodeECCN CodeTerminal FinishHTS CodePeak Reflow Temperature (Cel)Number of FunctionsTime@Peak Reflow Temperature-Max (s)Pin CountSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Programming VoltageWrite Cycle Time-Max (tWC)Height Seated (Max)LengthREACH SVHCPbfree CodeQualification StatusView Compare
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NAND512R3A2CZA6ESurface MountSurface Mount63-TFBGA63-40°C~85°C TATray2009Obsolete3 (168 Hours)64FLASH - NAND1.7V~1.95VBOTTOM1.8V0.8mmNAND512-AR-PBGA-B641.8V512Mb 64M x 815mANon-VolatileFLASHParallel64MX8850ns26b512 Mb0.00005A45 nsAsynchronous8bNONOYES4K16K512wordsYESNoROHS3 Compliant-------------------
-
Surface MountSurface Mount48-TFSOP (0.724, 18.40mm Width)48-40°C~85°C TATray2008Obsolete3 (168 Hours)48FLASH - NAND2.7V~3.6VDUAL3V0.5mmNAND01G-A--1Gb 128M x 830mANon-VolatileFLASHParallel128MX8825ns28b1 Gb0.00005A25000 nsAsynchronous8bNONOYES1K128K2kBYESNoROHS3 Compliante33A991.B.1.AMatte Tin (Sn)8542.32.00.51260130483.6V3/3.3V2.7V3V25ms1.2mm18.4mmNo SVHC--
-
Surface MountSurface Mount63-TFBGA63-40°C~85°C TATray2004Obsolete3 (168 Hours)63FLASH - NAND2.7V~3.6VBOTTOM3V0.8mmNAND01G-A--1Gb 128M x 830mANon-VolatileFLASHParallel128MX8830ns28b1 Gb0.00005A20 nsAsynchronous8bNONOYES1K128K2KwordsYES-ROHS3 Compliante13A991.B.1.ATIN SILVER COPPER8542.32.00.51260130633.6V3/3.3V2.7V3V-1.05mm12mm-yesNot Qualified
-
Surface MountSurface Mount63-TFBGA63-40°C~85°C TATray2008Discontinued3 (168 Hours)63FLASH - NAND1.7V~1.95VBOTTOM1.8V0.8mmNAND02G-1.8V2Gb 256M x 820mANon-VolatileFLASHParallel256MX8845ns8b2 Gb0.00005A25000 nsAsynchronous8bNONOYES2K128K2kBYESNoROHS3 Compliante13A991.B.1.ATIN SILVER COPPER8542.32.00.51260130631.95V-1.7V--1.05mm11mm---
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