NAND02GR3B2DZA6E

Micron Technology Inc. NAND02GR3B2DZA6E

Part Number:
NAND02GR3B2DZA6E
Manufacturer:
Micron Technology Inc.
Ventron No:
3731112-NAND02GR3B2DZA6E
Description:
IC FLASH 2GBIT 63VFBGA
ECAD Model:
Datasheet:
NAND02GxxBxD

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Specifications
Micron Technology Inc. NAND02GR3B2DZA6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND02GR3B2DZA6E.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    63-TFBGA
  • Number of Pins
    63
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2008
  • JESD-609 Code
    e1
  • Part Status
    Discontinued
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    63
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NAND
  • Voltage - Supply
    1.7V~1.95V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    NAND02G
  • Pin Count
    63
  • Operating Supply Voltage
    1.8V
  • Supply Voltage-Max (Vsup)
    1.95V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Memory Size
    2Gb 256M x 8
  • Nominal Supply Current
    20mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    256MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    45ns
  • Address Bus Width
    8b
  • Density
    2 Gb
  • Standby Current-Max
    0.00005A
  • Access Time (Max)
    25000 ns
  • Sync/Async
    Asynchronous
  • Word Size
    8b
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Command User Interface
    YES
  • Number of Sectors/Size
    2K
  • Sector Size
    128K
  • Page Size
    2kB
  • Ready/Busy
    YES
  • Height Seated (Max)
    1.05mm
  • Length
    11mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
NAND02GR3B2DZA6E Overview
This product is a surface mount device with a 63-TFBGA package. It is packaged in a tray and has 63 terminations. The voltage supply for this device is 1.7V to 1.95V. It has a pin count of 63 and a memory size of 2Gb, with a configuration of 256M x 8. The maximum access time for this device is 25000 nanoseconds and it can operate in both synchronous and asynchronous modes. The page size for this product is 2kB.

NAND02GR3B2DZA6E Features
Package / Case: 63-TFBGA
63 Pins
Operating Supply Voltage:1.8V


NAND02GR3B2DZA6E Applications
There are a lot of Micron Technology Inc.
NAND02GR3B2DZA6E Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
NAND02GR3B2DZA6E More Descriptions
NAND Flash Parallel 1.8V 2Gbit 256M x 8bit 25us 63-Pin VFBGA Tray
IC FLASH 2GBIT PARALLEL 63VFBGA
IC SDRAM 256MBIT 167MHZ 66TSOP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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