Micron Technology Inc. NAND01GW3B2BZA6E
- Part Number:
- NAND01GW3B2BZA6E
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3731138-NAND01GW3B2BZA6E
- Description:
- IC FLASH 1GBIT 30NS 63VFBGA
- Datasheet:
- NAND01G-B2B, NAND02G-B2C
Micron Technology Inc. NAND01GW3B2BZA6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND01GW3B2BZA6E.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case63-TFBGA
- Number of Pins63
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2004
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations63
- ECCN Code3A991.B.1.A
- Terminal FinishTIN SILVER COPPER
- HTS Code8542.32.00.51
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)30
- Base Part NumberNAND01G-A
- Pin Count63
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size1Gb 128M x 8
- Nominal Supply Current30mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization128MX8
- Memory Width8
- Write Cycle Time - Word, Page30ns
- Address Bus Width28b
- Density1 Gb
- Standby Current-Max0.00005A
- Access Time (Max)20 ns
- Sync/AsyncAsynchronous
- Word Size8b
- Programming Voltage3V
- Data PollingNO
- Toggle BitNO
- Command User InterfaceYES
- Number of Sectors/Size1K
- Sector Size128K
- Page Size2Kwords
- Ready/BusyYES
- Height Seated (Max)1.05mm
- Length12mm
- RoHS StatusROHS3 Compliant
NAND01GW3B2BZA6E Overview
The operating temperature of this electronic device ranges from -40°C to 85°C, making it suitable for use in a wide range of environments. It has been assigned the TA,JESD-609 code of e1, indicating that it meets the industry standards for reliability and performance. With a terminal pitch of 0.8mm, this device is designed to have a compact and efficient layout. It also has a single function, making it easy to use and integrate into various systems. The nominal supply current of 30mA ensures low power consumption, while the asynchronous sync/async feature allows for flexible operation. With a word size of 8b and sector size of 128K, this device is capable of handling large amounts of data. The ready/busy indicator is set to YES, providing users with a clear indication of its status. Additionally, the maximum seated height of 1.05mm ensures a secure and stable connection.
NAND01GW3B2BZA6E Features
Package / Case: 63-TFBGA
63 Pins
NAND01GW3B2BZA6E Applications
There are a lot of Micron Technology Inc.
NAND01GW3B2BZA6E Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The operating temperature of this electronic device ranges from -40°C to 85°C, making it suitable for use in a wide range of environments. It has been assigned the TA,JESD-609 code of e1, indicating that it meets the industry standards for reliability and performance. With a terminal pitch of 0.8mm, this device is designed to have a compact and efficient layout. It also has a single function, making it easy to use and integrate into various systems. The nominal supply current of 30mA ensures low power consumption, while the asynchronous sync/async feature allows for flexible operation. With a word size of 8b and sector size of 128K, this device is capable of handling large amounts of data. The ready/busy indicator is set to YES, providing users with a clear indication of its status. Additionally, the maximum seated height of 1.05mm ensures a secure and stable connection.
NAND01GW3B2BZA6E Features
Package / Case: 63-TFBGA
63 Pins
NAND01GW3B2BZA6E Applications
There are a lot of Micron Technology Inc.
NAND01GW3B2BZA6E Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
NAND01GW3B2BZA6E More Descriptions
NAND Flash Memory, 1 Gbit, 8-Bit Bus, 2.7 to 3.6 V, -40 to 85 C, VFBGA63 9x11 mm
NAND Flash Parallel 3V/3.3V 1Gbit 128M x 8bit 25us 63-Pin VFBGA Tray
128MX8 FLASH 3V PROM, 25000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63
Flash, 128MX8, 25000ns, PBGA63
NAND Flash 1 Gbit 2Gbit 2112b 1/8 V/3 V NFM
NAND Flash Parallel 3V/3.3V 1Gbit 128M x 8bit 25us 63-Pin VFBGA Tray
128MX8 FLASH 3V PROM, 25000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63
Flash, 128MX8, 25000ns, PBGA63
NAND Flash 1 Gbit 2Gbit 2112b 1/8 V/3 V NFM
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