NAND01GW3B2BZA6E

Micron Technology Inc. NAND01GW3B2BZA6E

Part Number:
NAND01GW3B2BZA6E
Manufacturer:
Micron Technology Inc.
Ventron No:
3731138-NAND01GW3B2BZA6E
Description:
IC FLASH 1GBIT 30NS 63VFBGA
ECAD Model:
Datasheet:
NAND01G-B2B, NAND02G-B2C

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Specifications
Micron Technology Inc. NAND01GW3B2BZA6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. NAND01GW3B2BZA6E.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    63-TFBGA
  • Number of Pins
    63
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2004
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    63
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NAND
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.8mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    NAND01G-A
  • Pin Count
    63
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    1Gb 128M x 8
  • Nominal Supply Current
    30mA
  • Memory Type
    Non-Volatile
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    128MX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    30ns
  • Address Bus Width
    28b
  • Density
    1 Gb
  • Standby Current-Max
    0.00005A
  • Access Time (Max)
    20 ns
  • Sync/Async
    Asynchronous
  • Word Size
    8b
  • Programming Voltage
    3V
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Command User Interface
    YES
  • Number of Sectors/Size
    1K
  • Sector Size
    128K
  • Page Size
    2Kwords
  • Ready/Busy
    YES
  • Height Seated (Max)
    1.05mm
  • Length
    12mm
  • RoHS Status
    ROHS3 Compliant
Description
NAND01GW3B2BZA6E Overview
The operating temperature of this electronic device ranges from -40°C to 85°C, making it suitable for use in a wide range of environments. It has been assigned the TA,JESD-609 code of e1, indicating that it meets the industry standards for reliability and performance. With a terminal pitch of 0.8mm, this device is designed to have a compact and efficient layout. It also has a single function, making it easy to use and integrate into various systems. The nominal supply current of 30mA ensures low power consumption, while the asynchronous sync/async feature allows for flexible operation. With a word size of 8b and sector size of 128K, this device is capable of handling large amounts of data. The ready/busy indicator is set to YES, providing users with a clear indication of its status. Additionally, the maximum seated height of 1.05mm ensures a secure and stable connection.

NAND01GW3B2BZA6E Features
Package / Case: 63-TFBGA
63 Pins


NAND01GW3B2BZA6E Applications
There are a lot of Micron Technology Inc.
NAND01GW3B2BZA6E Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
NAND01GW3B2BZA6E More Descriptions
NAND Flash Memory, 1 Gbit, 8-Bit Bus, 2.7 to 3.6 V, -40 to 85 C, VFBGA63 9x11 mm
NAND Flash Parallel 3V/3.3V 1Gbit 128M x 8bit 25us 63-Pin VFBGA Tray
128MX8 FLASH 3V PROM, 25000ns, PBGA63, 9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, VFBGA-63
Flash, 128MX8, 25000ns, PBGA63
NAND Flash 1 Gbit 2Gbit 2112b 1/8 V/3 V NFM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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