M2S090TS-1FG676I

Microsemi Corporation M2S090TS-1FG676I

Part Number:
M2S090TS-1FG676I
Manufacturer:
Microsemi Corporation
Ventron No:
3669270-M2S090TS-1FG676I
Description:
IC FPGA SOC 90K LUTS 676FBGA
ECAD Model:
Datasheet:
SmartFusion2 Datasheet SmartFusion2 Pin Descriptions

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Specifications
Microsemi Corporation M2S090TS-1FG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090TS-1FG676I.
  • Factory Lead Time
    8 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    676-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Frequency
    166MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    M2S090TS
  • JESD-30 Code
    S-PBGA-B676
  • Number of Outputs
    425
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Interface
    CAN, Ethernet, I2C, SPI, UART, USART, USB
  • Number of I/O
    425
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    425
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Core Architecture
    ARM
  • Primary Attributes
    FPGA - 90K Logic Modules
  • Number of Logic Cells
    86316
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Microsemi Corporation brand offers a wide range of high-quality electronic components, including their Embedded - System On Chip (SoC) chips. These chips belong to the Embedded - System On Chip (SoC) category and have an HTS Code of 8542.39.00.01. They are built with CMOS technology and have a supply voltage of 1.2V, with a maximum voltage of 1.26V. One example of their SoC chip is the M2S090TS, which has a variety of interfaces such as CAN, Ethernet, I2C, SPI, UART, USART, and USB. It also boasts an impressive 425 I/O ports and a RAM size of 64KB. Other peripherals included are DDR, PCIe, and SERDES. Additionally, the chip has a maximum seated height of 2.44mm.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S090TS-1FG676I System On Chip (SoC) applications.

Microcontroller based SoC ( RISC-V, ARM)
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M2S090TS-1FG676I More Descriptions
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray
M2S090Ts-1Fg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FG676I
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
Product Comparison
The three parts on the right have similar specifications to M2S090TS-1FG676I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Core Architecture
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Speed
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    View Compare
  • M2S090TS-1FG676I
    M2S090TS-1FG676I
    8 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    676-BGA
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    676
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    166MHz
    NOT SPECIFIED
    M2S090TS
    S-PBGA-B676
    425
    Not Qualified
    1.26V
    1.2V
    1.14V
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    425
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    425
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    FPGA - 90K Logic Modules
    86316
    512KB
    2.44mm
    27mm
    27mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
  • M2S050TS-FG896
    4 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    896
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    -
    NOT SPECIFIED
    -
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    377
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    Non-RoHS Compliant
    2015
    166MHz
    -
    -
    -
  • M2S050T-FGG896I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    896
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    -
    NOT SPECIFIED
    -
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    377
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    RoHS Compliant
    -
    166MHz
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    166MHz
    -
    M2S025
    -
    -
    -
    -
    -
    -
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    267
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    ARM
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    2009
    166MHz
    484-FPBGA (23x23)
    85°C
    0°C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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