Microsemi Corporation M2S090TS-1FG676I
- Part Number:
- M2S090TS-1FG676I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3669270-M2S090TS-1FG676I
- Description:
- IC FPGA SOC 90K LUTS 676FBGA
Microsemi Corporation M2S090TS-1FG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090TS-1FG676I.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Frequency166MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberM2S090TS
- JESD-30 CodeS-PBGA-B676
- Number of Outputs425
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O425
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs425
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Primary AttributesFPGA - 90K Logic Modules
- Number of Logic Cells86316
- Flash Size512KB
- Height Seated (Max)2.44mm
- Length27mm
- Width27mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Microsemi Corporation brand offers a wide range of high-quality electronic components, including their Embedded - System On Chip (SoC) chips. These chips belong to the Embedded - System On Chip (SoC) category and have an HTS Code of 8542.39.00.01. They are built with CMOS technology and have a supply voltage of 1.2V, with a maximum voltage of 1.26V. One example of their SoC chip is the M2S090TS, which has a variety of interfaces such as CAN, Ethernet, I2C, SPI, UART, USART, and USB. It also boasts an impressive 425 I/O ports and a RAM size of 64KB. Other peripherals included are DDR, PCIe, and SERDES. Additionally, the chip has a maximum seated height of 2.44mm.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090TS-1FG676I System On Chip (SoC) applications.
Microcontroller based SoC ( RISC-V, ARM)
Special Issue Editors
Smartphones
Print Special Issue Flyer
Mobile market
Functional safety for critical applications in the aerospace
Automotive
Body control module
Functional safety for critical applications in the industrial sectors
Industrial automation devices
The Microsemi Corporation brand offers a wide range of high-quality electronic components, including their Embedded - System On Chip (SoC) chips. These chips belong to the Embedded - System On Chip (SoC) category and have an HTS Code of 8542.39.00.01. They are built with CMOS technology and have a supply voltage of 1.2V, with a maximum voltage of 1.26V. One example of their SoC chip is the M2S090TS, which has a variety of interfaces such as CAN, Ethernet, I2C, SPI, UART, USART, and USB. It also boasts an impressive 425 I/O ports and a RAM size of 64KB. Other peripherals included are DDR, PCIe, and SERDES. Additionally, the chip has a maximum seated height of 2.44mm.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090TS-1FG676I System On Chip (SoC) applications.
Microcontroller based SoC ( RISC-V, ARM)
Special Issue Editors
Smartphones
Print Special Issue Flyer
Mobile market
Functional safety for critical applications in the aerospace
Automotive
Body control module
Functional safety for critical applications in the industrial sectors
Industrial automation devices
M2S090TS-1FG676I More Descriptions
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray
M2S090Ts-1Fg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FG676I
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
M2S090Ts-1Fg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FG676I
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
The three parts on the right have similar specifications to M2S090TS-1FG676I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypeCore ArchitecturePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPublishedSpeedSupplier Device PackageMax Operating TemperatureMin Operating TemperatureView Compare
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M2S090TS-1FG676I8 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)676-BGAYES-40°C~100°C TJTraySmartFusion®2e0Active3 (168 Hours)676Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliant166MHzNOT SPECIFIEDM2S090TSS-PBGA-B676425Not Qualified1.26V1.2V1.14VCAN, Ethernet, I2C, SPI, UART, USART, USB42564KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA425FIELD PROGRAMMABLE GATE ARRAYARMFPGA - 90K Logic Modules86316512KB2.44mm27mm27mmNon-RoHS Compliant------
-
4 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES0°C~85°C TJTraySmartFusion®2e0Active3 (168 Hours)896Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliant-NOT SPECIFIED-S-PBGA-B896377Not Qualified1.26V1.2V1.14V-37764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAY-FPGA - 50K Logic Modules56340256KB2.44mm31mm31mmNon-RoHS Compliant2015166MHz---
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm--NOT SPECIFIED-S-PBGA-B896377Not Qualified1.26V1.2V1.14V-37764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAY-FPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant-166MHz---
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTraySmartFusion®2-Active3 (168 Hours)-----------166MHz-M2S025------CAN, Ethernet, I2C, SPI, UART, USART, USB26764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--ARMFPGA - 25K Logic Modules-256KB---Non-RoHS Compliant2009166MHz484-FPBGA (23x23)85°C0°C
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