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M2S090TS-1FG484M

Microsemi Corporation M2S090TS-1FG484M

Part Number:
M2S090TS-1FG484M
Manufacturer:
Microsemi Corporation
Ventron No:
3828106-M2S090TS-1FG484M
Description:
IC FPGA SOC 90K LUTS 484FBGA
ECAD Model:
Datasheet:
M2GL0xx Product Brief

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Specifications
Microsemi Corporation M2S090TS-1FG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090TS-1FG484M.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    484-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -55°C~125°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    3A001.A.2.C
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B484
  • Number of Outputs
    267
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    267
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    267
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 90K Logic Modules
  • Number of Logic Cells
    86316
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The 484-BGA package or case is a popular choice for electronic components due to its compact size and efficient design. This packaging is typically used for tray packaging, which allows for easy handling and storage. The part status for this package is active, meaning it is currently in production and readily available for use. With 484 terminations, this package offers a high level of connectivity, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. The terminal position is located at the bottom of the package, with a ball terminal form. The peak reflow temperature for this package is not specified, but it is compliant with the JESD-30 Code for S-PBGA-B484. Additionally, the length of this package is 23mm, making it a versatile option for a variety of electronic applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S090TS-1FG484M System On Chip (SoC) applications.

Vending machines
Industrial sectors
Industrial robot
Personal Computers
Avionics
Functional safety for critical applications in the industrial sectors
Communication interfaces ( I2C, SPI )
Self-aware system-on-chip (SoC)
Measurement tools
External USB hard disk/SSD
M2S090TS-1FG484M More Descriptions
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 484-Pin FBGA Tray
M2S090Ts-1Fg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090TS-1FG484M
Field Programmable Gate Array, 86184-Cell, PBGA484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-A9 667MHZ 676FCBGA
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S090TS-1FG484M.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Pbfree Code
    View Compare
  • M2S090TS-1FG484M
    M2S090TS-1FG484M
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    484-BGA
    YES
    -55°C~125°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    484
    3A001.A.2.C
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B484
    267
    Not Qualified
    1.26V
    1.2V
    1.14V
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    267
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 90K Logic Modules
    86316
    512KB
    2.44mm
    23mm
    23mm
    Non-RoHS Compliant
    -
    -
    -
  • M2S060T-1FGG676
    M2S060T-1FGG676
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    -
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    387
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    M2S090TS-1FG484M vs M2S060T-1FGG676
  • M2S005-1TQ144I
    M2S005-1TQ144I
    Microsemi Corporation
    -
    OBSOLETE (Last Updated: 3 weeks ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e0
    Obsolete
    3 (168 Hours)
    144
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    not_compliant
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 5K Logic Modules
    -
    128KB
    1.6mm
    20mm
    20mm
    Non-RoHS Compliant
    2015
    no
    M2S090TS-1FG484M vs M2S005-1TQ144I
  • M2S010-1TQG144
    M2S010-1TQG144
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    144-LQFP
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    -
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    -
    NOT SPECIFIED
    S-PQFP-G144
    84
    Not Qualified
    1.26V
    1.2V
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    84
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    2015
    -
    M2S090TS-1FG484M vs M2S010-1TQG144
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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