M2S090T-1FGG484M

Microsemi Corporation M2S090T-1FGG484M

Part Number:
M2S090T-1FGG484M
Manufacturer:
Microsemi Corporation
Ventron No:
3669326-M2S090T-1FGG484M
Description:
IC FPGA SOC 90K LUTS 484FBGA
ECAD Model:
Datasheet:
M2GL0xx Product Brief

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Specifications
Microsemi Corporation M2S090T-1FGG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090T-1FGG484M.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    484-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -55°C~125°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    3A001.A.2.C
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B484
  • Number of Outputs
    267
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    267
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    267
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 90K Logic Modules
  • Number of Logic Cells
    86316
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The part in question is manufactured by Microsemi Corporation and falls under the category of Embedded - System On Chip (SoC) chips. It has a terminal finish of MATTE TIN and its peak reflow temperature is not specified. The terminal pitch for this chip is 1mm and its JESD-30 Code is S-PBGA-B484. Currently, it has not been qualified for use. The chip has a RAM size of 64KB and is powered by an ARM® Cortex®-M3 core processor. Its primary attribute is being an FPGA with 90K logic modules. The maximum seated height of the chip is 2.44mm and it measures 23mm in length.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S090T-1FGG484M System On Chip (SoC) applications.

ARM support modules
Three phase UPS
POS Terminals
Networked Media Encode/Decode
Communication interfaces ( I2C, SPI )
Special Issue Editors
Functional safety for critical applications in the industrial sectors
POS Terminals
Mouse
Transmitters
M2S090T-1FGG484M More Descriptions
FPGA SmartFusion2 Family 86316 Cells 65nm Technology 1.2V 484-Pin FPBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
M2S090T-1Fgg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-1FGG484M
Field Programmable Gate Array, 86184-Cell, PBGA484
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S090T-1FGG484M.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Reach Compliance Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S090T-1FGG484M
    M2S090T-1FGG484M
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    484-BGA
    YES
    -55°C~125°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    484
    3A001.A.2.C
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B484
    267
    Not Qualified
    1.26V
    1.2V
    1.14V
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    267
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 90K Logic Modules
    86316
    512KB
    2.44mm
    23mm
    23mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S050TS-FG896
    4 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    896-BGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    896
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B896
    377
    Not Qualified
    1.26V
    1.2V
    1.14V
    377
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    377
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    2.44mm
    31mm
    31mm
    Non-RoHS Compliant
    2015
    not_compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S010-1TQG144
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    144-LQFP
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    -
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    84
    Not Qualified
    1.26V
    1.2V
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    84
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    2015
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    2009
    -
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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