Microsemi Corporation M2S090T-1FG484I
- Part Number:
- M2S090T-1FG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3828190-M2S090T-1FG484I
- Description:
- IC FPGA SOC 90K LUTS 484FBGA
- ECAD Model:
-
Microsemi Corporation M2S090T-1FG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090T-1FG484I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSmartFusion®2
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Frequency166MHz
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberM2S090T
- JESD-30 CodeS-PBGA-B484
- Number of Outputs267
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- InterfaceCAN, Ethernet, I2C, SPI, UART, USART, USB
- Number of I/O267
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs267
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Core ArchitectureARM
- Primary AttributesFPGA - 90K Logic Modules
- Number of Logic Cells86316
- Flash Size512KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
This particular component is manufactured by Microsemi Corporation and falls under the category of Embedded - System On Chip (SoC) chips. It is currently in production, with the last update being one month ago. Its operating temperature range is -40°C to 100°C TJ and it has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The chip has a frequency of 166MHz and has not yet been qualified. It requires a power supply of 1.2V and its core architecture is ARM. The flash size of this chip is 512KB and its maximum seated height is 2.44mm. Its length measures at 23mm.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090T-1FG484I System On Chip (SoC) applications.
Test and Measurement
Smart appliances
Microcontroller
Transmitters
Functional safety for critical applications in the industrial sectors
Body control module
Networked Media Encode/Decode
Optical drive
Medical Pressure
Measurement testers
This particular component is manufactured by Microsemi Corporation and falls under the category of Embedded - System On Chip (SoC) chips. It is currently in production, with the last update being one month ago. Its operating temperature range is -40°C to 100°C TJ and it has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The chip has a frequency of 166MHz and has not yet been qualified. It requires a power supply of 1.2V and its core architecture is ARM. The flash size of this chip is 512KB and its maximum seated height is 2.44mm. Its length measures at 23mm.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090T-1FG484I System On Chip (SoC) applications.
Test and Measurement
Smart appliances
Microcontroller
Transmitters
Functional safety for critical applications in the industrial sectors
Body control module
Networked Media Encode/Decode
Optical drive
Medical Pressure
Measurement testers
M2S090T-1FG484I More Descriptions
FPGA SmartFusion2 86184 Cells 166MHz 65nm Technology 1.2V 484-Pin FBGA
M2S090T-1Fg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-1FG484I
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
M2S090T-1Fg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-1FG484I
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S090T-1FG484I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeFrequencyReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceNumber of I/ORAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypeCore ArchitecturePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPbfree CodeSpeedSupplier Device PackageMax Operating TemperatureMin Operating TemperatureView Compare
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M2S090T-1FG484I10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGAYES-40°C~100°C TJTray2009SmartFusion®2e0Active3 (168 Hours)484Tin/Lead (Sn/Pb)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliant166MHzNOT SPECIFIEDM2S090TS-PBGA-B484267Not Qualified1.26V1.2V1.14VCAN, Ethernet, I2C, SPI, UART, USART, USB26764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA267FIELD PROGRAMMABLE GATE ARRAYARMFPGA - 90K Logic Modules86316512KB2.44mm23mm23mmNon-RoHS Compliant------ -
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mm--NOT SPECIFIED-S-PQFP-G144--1.26V-1.14V-8464KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAY-FPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliantyes166MHz---
-
8 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES-40°C~100°C TJTray-SmartFusion®2e3Active3 (168 Hours)896MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm--NOT SPECIFIED-S-PBGA-B896377Not Qualified1.26V1.2V1.14V-37764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAY-FPGA - 50K Logic Modules56340256KB2.44mm31mm31mmRoHS Compliant-166MHz---
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------166MHz-M2S025------CAN, Ethernet, I2C, SPI, UART, USART, USB26764KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--ARMFPGA - 25K Logic Modules-256KB---Non-RoHS Compliant-166MHz484-FPBGA (23x23)85°C0°C
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