Microsemi Corporation M2S090-FGG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.The manufacturer assigns this system on a chip with a 676-BGA package.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the SmartFusion?2 series.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines FPGA - 90K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 425 I/Os.It is advised to utilize a 1.2V power supply.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.It is really beneficial to have system on a chip since there are 676 terminations in total.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 425 outputs available on this SoC.A power supply of 1.2V is required.This SoC chip is equipped with 425 inputs for the user to choose from.In logic system on chips, there are 86316 logic cells.This flash has a size of 512KB.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S090-FGG676I System On Chip (SoC) applications.

Transmitters
Sports
Healthcare
Embedded systems
Sensor network-on-chip (sNoC)
Personal Computers
DC-input BLDC motor drive
Efficient hardware for training of neural networks
Published Paper
Mobile computing