Home > Products > Integrated Circuits (ICs) > Embedded - System On Chip (SoC) > M2S090-FG676I
M2S090-FG676I

Microsemi Corporation M2S090-FG676I

Part Number:
M2S090-FG676I
Manufacturer:
Microsemi Corporation
Ventron No:
3828227-M2S090-FG676I
Description:
IC FPGA SOC 90K LUTS 676FBGA
ECAD Model:
Datasheet:
M2S090-FG676I

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Microsemi Corporation M2S090-FG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090-FG676I.
  • Factory Lead Time
    6 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    676-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    SmartFusion®2
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B676
  • Number of Outputs
    425
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    425
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    425
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 90K Logic Modules
  • Number of Logic Cells
    86316
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    Non-RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The 676-BGA package/case is designed for surface mount installation and can withstand an operating temperature range of -40°C to 100°C. The moisture sensitivity level is 3, indicating that the product can be exposed to ambient moisture for up to 168 hours without causing damage. The supply voltage for this product is 1.2V, with a maximum supply voltage of 1.26V. It requires a power supply of 1.2V and has a flash size of 512KB. The maximum seated height is 2.44mm and the width is 27mm.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation
M2S090-FG676I System On Chip (SoC) applications.

Central alarm system
Functional safety for critical applications in the automotive
Automotive
Efficient hardware for training of neural networks
Level
Servo drive control module
POS Terminals
Apple smart watch
Functional safety for critical applications in the aerospace
Cyber security for critical applications in the aerospace
M2S090-FG676I More Descriptions
M2S090-Fg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090-FG676I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
Product Comparison
The three parts on the right have similar specifications to M2S090-FG676I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S090-FG676I
    M2S090-FG676I
    Microsemi Corporation
    6 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    676-BGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    SmartFusion®2
    e0
    Active
    3 (168 Hours)
    676
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    not_compliant
    NOT SPECIFIED
    S-PBGA-B676
    425
    Not Qualified
    1.26V
    1.2V
    1.14V
    425
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    425
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 90K Logic Modules
    86316
    512KB
    2.44mm
    27mm
    27mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S010-1TQG144
    M2S010-1TQG144
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    144-LQFP
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    -
    NOT SPECIFIED
    S-PQFP-G144
    84
    Not Qualified
    1.26V
    1.2V
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    84
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    M2S090-FG676I vs M2S010-1TQG144
  • M2S025-1FG484
    M2S025-1FG484
    Microsemi Corporation
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    M2S090-FG676I vs M2S025-1FG484
  • M2S025T-1FGG484I
    M2S025T-1FGG484I
    Microsemi Corporation
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
    M2S090-FG676I vs M2S025T-1FGG484I
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
Related parts for M2S090-FG676I
Popular Search Part Number Related Keywords Search Tags

Latest News

  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.